MOUNTAIN VIEW, Calif.,
Feb. 15, 2012 /PRNewswire/ -- CEVA,
Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon
intellectual property (SIP) platform solutions and DSP cores and
Dirac Research AB, a specialist in high-end audio technology,
announced today that the companies have partnered to deliver
advanced speaker correction capabilities for the 32-bit
CEVA-TeakLite-III DSP targeting mobile, home and automotive
applications. These Dirac technologies extend CEVA's leadership in
low-power, high-performance, audio platforms and this solution is
already in use by a top-tier audio chip vendor.
The Dirac HD Sound solution is a mixed-phase speaker correction
technology that optimizes a sound system's transient reproduction
for optimal performance and clarity. This software offering has now
been fully optimized for the native 32-bit processing capabilities
of the CEVA-TeakLite-III architecture, ensuring a cost-efficient
low power and low system overhead solution, even within constrained
systems. The two companies will demonstrate the combined solution
at the upcoming Mobile World Congress in Barcelona, Feb 27-
March 1, 2012, in CEVA's booth (Hall 1, Stand 1F 33).
"CEVA is recognized for its advanced 32-bit audio DSPs, with
numerous production design wins and broad market adoption. Their
audio-tuned architecture and advanced instruction set provide a
cost-effective and high-quality platform on which to implement the
Dirac HD Sound technology. Using CEVA's comprehensive software
development tools and their excellent support, we were able to
produce and demonstrate a fully optimized version of Dirac HD Sound
in a matter of days," said Mathias
Johansson, CEO at Dirac.
"We are pleased to add Dirac's premium quality audio
post-processing capability to the ecosystem of our
CEVA-TeakLite-III DSP, supporting more than 90 voice and audio
codecs and pre/post-processing functions," said Eran Briman, vice president of marketing at
CEVA, "Dirac's approach enables a high quality post-processing
solution for developers of audio ICs in an easy to deploy,
cost-efficient manner."
The Dirac HD Sound technology has been proven across a range of
high-end audio applications in the consumer, cinema, professional
and automotive markets. The technology enhances many audio and
voice aspects, including voice correction, stereo image correction,
bass correction, listening fatigue minimization, and tonal and
transient correction.
The CEVA-TeakLite-III is a native 32-bit, high performance audio
DSP core, used in mobile application processors, audio CODEC chips,
baseband processor chips and home entertainment main SoCs , to
handle, among other tasks, advanced audio scenarios, such as
multi-stream audio playback with various post-processing functions
for enhanced audio experience. The DSP-based solution includes a
configurable cached memory subsystem, a comprehensive set of
optimized HD audio codecs, and complete software development kit,
including software development tools, prototype boards, test chips,
system drivers and RTOS.
About Dirac Research:
Founded in 2001, Dirac Research is a premier R&D company
specializing in high-performance digital sound optimization, room
correction and sound field synthesis. The company was founded by
researchers from the Signals & Systems Group of Uppsala University, Sweden, which has fostered 8 Nobel Prize
laureates. With Dirac's patented toolbox for efficient and accurate
audio system optimization, customers such as BMW, Bentley, Rolls Royce and Datasat Digital
Entertainment have achieved dramatically improved sound quality and
a shortened time-to-market. Dirac Research maintains offices in
Sweden, Tokyo, Detroit, San
Diego, Seoul and
Shanghai. www.dirac.se.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual
property (SIP) DSP cores and platform solutions for the mobile
handset, portable and consumer electronics markets. CEVA's IP
portfolio includes comprehensive technologies for cellular baseband
(2G / 3G / 4G), multimedia (HD video, Image Signal Processing (ISP)
and HD audio), voice over packet (VoP), Bluetooth, Serial Attached
SCSI (SAS) and Serial ATA (SATA). In 2011, CEVA's IP was shipped in
over 1 billion devices, powering handsets from 7 out of the top 8
handset OEMs, including Nokia, Samsung, LG, Motorola, Sony and ZTE.
Today, more than 40% of handsets shipped worldwide are powered by a
CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow
CEVA on twitter at www.twitter.com/cevadsp.
SOURCE CEVA, Inc.