New TDR Option for Advantest’s TS9000 Series of Terahertz Analysis Systems Provides High Resolution Error Detection for Adv...
22 Octubre 2015 - 8:00AM
Business Wire
Short-pulse Signal Technology Enables 5μm
Resolution Fault Isolation to Pinpoint and Map Circuit Defects
Leading semiconductor test equipment supplier Advantest
Corporation (TSE: 6857, NYSE: ATE) announced today that it has
initiated sales of its new TDR Option for the company’s TS9000
series of terahertz analysis systems. The new option enables
analysis of circuit quality in semiconductors, printed substrates,
electronic components, and other applications, utilizing
short-pulse terahertz waves.
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Advantest will demonstrate its new TS9000 terahertz analysis
systems for the semiconductor industry in booth 619, at the
International Microelectronics Assembly and Packaging Society
conference in Orlando, FL, October 27-29, 2015 at the Rosen Center
Hotel. IMAPS is the largest society dedicated to the advancement
and growth of microelectronics and electronics packaging
technologies. More information on IMAPS can be found at:
http://www.imaps.org/imaps2015/
Background
Electronic device circuit quality analysis is commonly performed
using oscilloscope TDR (time domain reflectometry). However, as
devices grow smaller and more highly integrated, the ability to
locate failures with extreme spatial precision has become
increasingly more important., Existing measurement instruments have
limited resolution, as the rise time of the short pulse cannot be
compressed much further, creating the risk that existing analysis
technologies will be inadequate to handle the requirements of the
highly integrated devices on the horizon. Advantest’s terahertz
analysis technology addresses these concerns and meets the need for
ultra-high-resolution measurement by utilizing short-pulse
terahertz waves for analysis of complex electrical circuits.
Key Features
The TS9000 TDR Option relies on Advantest’s market-proven
TDT/TDR* measurement technology to pinpoint and map circuit defects
utilizing short-pulse signal processing. The solution delivers
circuit analysis with an extremely high spatial precision of less
than 5μm, and a maximum measurement range of 300 mm, including for
internal circuitry used in through-silicon vias (TSVs) and
interposers. Moreover, with the optional TDR/TDT CAD Data Link,
errors located can be mapped and displayed on the CAD data of the
target device, making it much easier for users to identify the
causes of errors. Three types of TDR/TDT probes, each with a
different resolution and measurement distance setting, are
available for the TS9000 TDR Option, as are customizations for
unique contact requirements.
Advantest announced the TS9000 MTA Option, a terahertz analysis
system for measuring semiconductor mold thickness, in September
2014. With the launch of the TDR Option, the TS9000 Series
continues to define the company’s new approach to measurement
utilizing terahertz technology, adding critical support for
advanced electronic device measurement and product quality
management.
* TDR (time domain reflectometry)/TDT (time domain
transmissometry) is widely used to locate circuit failures. Signals
are output and the times taken for them to be reflected /
transmitted through the target device, as well as their waveforms,
form the basis of measurement calculations, allowing users to
determine the transmissivity and other qualities of the device.
Key Specifications
Maximum DUT size:
150mm×150mm Fault position locating resolution: < 5 µm
Available measurement length: > 300 mm (In TDR configuration)
> 600 mm (In TDT configuration)
Measurement time:
< 5 min/point @ TDR 300 mm Size/Weight Probe Station: 1230mm(W)
x 830mm(D) x 700mm(H) / 140kg or less Analysis Unit: 430mm(W) x
540mm(D) x 230mm(H) / 30kg or less
Optical Unit:
430mm(W) x 240mm(D) x 220mm(H) / 14kg or less
About Advantest
Corporation
A world-class technology company, Advantest is the leading
producer of automatic test equipment (ATE) for the semiconductor
industry and a premier manufacturer of measuring instruments used
in the design and production of electronic instruments and systems.
Its leading-edge systems and products are integrated into the most
advanced semiconductor production lines in the world. The company
also focuses on R&D for emerging markets that benefit from
advancements in nanotech and terahertz technologies, and has
introduced multi-vision metrology scanning electron microscopes
essential to photomask manufacturing, as well as groundbreaking 3D
imaging and analysis tools. Founded in Tokyo in 1954, Advantest
established its first subsidiary in 1982, in the USA, and now has
subsidiaries worldwide. More information is available at
www.advantest.com.
All information supplied in this release is
correct at the time of publication, but may be subject to
change.
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Advantest CorporationHiroki Yanagita,
088-3-3214-7500hiroki.yanagita@advantest.com
Advantest (PK) (USOTC:ATEYY)
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