Supermicro's Expanded, Proven Portfolio
Includes Systems Designed for Maximum Performance-Per-Watt on
Cloud-Native, Storage Optimized, and Scale-Out Workloads, and Air
and Liquid- Cooled Systems for AI and HPC Environments
SAN JOSE, Calif. and
TAIPEI, June 4, 2024 /PRNewswire/ -- Computex 2024
-- Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution
Provider for AI, Cloud, Storage, and 5G/Edge, is launching its X14
server portfolio with support for Intel®
Xeon® 6700-series processors with E-cores, and will
provide future support of Intel Xeon 6900 series processors with
P-cores. Based on platforms proven over several generations, the
new Supermicro X14 servers support the latest Intel Xeon 6
processors, starting with a family of rackmount servers supporting
enterprise, cloud service provider, mid-range, and entry models,
including the Hyper, CloudDC, and WIO platforms. Also, the density
and efficiency-optimized multi-node servers, the
SuperBlade®, with up to 34,560 cores per rack,
BigTwin®, and GrandTwin®, will incorporate
this new processor. Supermicro's Petascale storage systems and Edge
and Telco-optimized servers, such as the Hyper-E and short-depth
compact systems, will also be available. In the future,
high-performance systems will soon be available with Intel Xeon
6900-series processors with P-cores. Systems with Intel Xeon 6
processors with P-cores will deliver 2-3X* better performance for
AI workloads and 2.8X* higher memory bandwidth. Future systems
using the Intel Xeon 6 processors with E-cores are expected to
deliver 2.5X* higher rack density than previous generations and a
2.4X* performance per watt improvement, resulting in reduced PUE of
a data center to as low as 1.05.
"Supermicro is an industry leader in designing, building, and
delivering workload-optimized solutions at scale, including data
center scale liquid cooling. The new X14 servers will provide even
greater flexibility and customization options to our customers,"
said Charles Liang, president and
CEO of Supermicro. "The Supermicro X14 product families are our
most powerful and flexible systems we have ever designed and are
optimized for a wide range of applications, from the data center to
the edge. We see that up to 20% of data centers will need to be
liquid cooled in the future, and Supermicro is uniquely positioned
to offer an entire solution, from cold plates to cooling
towers."
For greater efficiency and lower TCO, Supermicro offers liquid
cooling solutions that can be added to any deployment, including
CPU and GPU cold plates, a cooling distribution unit, manifold,
tubing, and a cooling tower, with all components developed and
manufactured in-house for a complete solution.
The new Intel Xeon 6 processors with E-cores feature a single
thread per core. They are optimized for workloads that benefit from
a more significant number of energy-efficient cores to run more
simultaneous instances at once using less power, such as
cloud-native CDNs, network microservices, cloud-native applications
such as Kubernetes, application DevOps, unstructured databases, and
scale-out analytics.
Supermicro X14 systems powered by the new Intel Xeon 6
processors feature pin compatibility between E-core and P-core
variants. Current and future Supermicro systems will feature up to
576 cores per node, DDR5-6400 and MCR DIMMs with up to 8800 MT/s,
CXL 2.0, wider E1.S and E3.S support, and up to 400G networking.
The new Intel Xeon 6 processors will be available in the
6700-series, an upgraded version of previous generation Intel Xeon
processors, and the 6900-series, an all-new class of processors to
maximize performance. Intel Xeon 6900-series processors will
feature more cores, higher TDP, increased memory channels, and
support for MCR DIMMs. The Supermicro X14 platform is also the
first Supermicro platform to support the OCP Data Center Modular
Hardware System (DC-MHS), which reduces complexity and simplifies
maintenance for large cloud service providers and hyperscalers.
"Intel is executing on its roadmap to deliver '4 nodes in 5
years', and with Xeon 6, we are introducing revolutionary new
processor features including our first ever enterprise-class
Efficient-core products for cloud-native and scale-out workloads ,"
said Ryan Tabrah, VP and GM of Xeon
6 E-Core Products at Intel. "These new processors are enabling our
partners such as Supermicro to develop new Xeon systems which are
denser and more efficient than ever before, helping customers to
achieve their business goals while lowering TCO."
The Supermicro portfolio of X14 systems is performance-optimized
and energy-efficient, incorporates improved manageability and
security, supports open industry standards, and is rack-scale
optimized. With a global production capacity of 5,000 racks per
month, including 1,350 liquid-cooled racks, Supermicro's expert
engineers can design, build, validate, and deliver complete systems
with industry-leading time-to-market.
Launching today with Intel Xeon 6700-series processors with
E-cores:
SuperBlade® – Supermicro's
high-performance, density-optimized, and energy-efficient
multi-node platform optimized for AI, Data Analytics, HPC, Cloud,
and Enterprise workloads. With these new blade systems, one rack
can feature up to 34,560 Xeon compute cores.
Hyper – Flagship performance rackmount servers
designed for scale-out cloud workloads, with storage & I/O
flexibility that provides a custom fit for a wide range of
application needs.
CloudDC – All-in-one platform for cloud data
centers, based on the OCP Data Center Modular Hardware System
(DC-MHS) with flexible I/O and storage configurations and dual AIOM
slots (PCIe 5.0; OCP 3.0 compliant) for maximum data
throughput.
WIO – Offers flexible I/O configurations in a
cost-effective architecture to deliver truly optimized systems for
specific enterprise requirements.
BigTwin® – 2U 2-Node or 2U 4-Node
platform providing superior density, performance, and
serviceability with dual processors per node and hot-swappable
tool-less design. These systems are ideal for cloud, storage, and
media workloads with new models, including E3.S drive support for
superior density and throughput.
GrandTwin® – Purpose-built for
single-processor performance and memory density, featuring front
(cold aisle) hot-swappable nodes and front or rear I/O for easier
serviceability. Now available with E1.S drives for better storage
density and throughput.
Hyper-E – Delivers the power and flexibility of our
flagship Hyper family optimized for deployment in edge
environments. Edge-friendly features include a short-depth chassis
and front I/O, making Hyper-E suitable for edge data centers and
telco cabinets. These short-depth systems support up to 3
high-performance GPU or FPGA cards.
Edge/Telco – High-density processing power in
compact form factors optimized for telco cabinet and Edge data
center installation. Optional DC power configurations and enhanced
operating temperatures up to 55° C (131° F).
Petascale Storage – Industry-leading storage density
and performance with EDSFF E1.S and E3.S drives, allowing
unprecedented capacity and performance in a single 1U or 2U
chassis.
Coming Soon with upcoming Intel Xeon 6 6900-series processors
with P-cores:
GPU Servers with PCIe GPUs – Systems supporting
advanced accelerators to deliver dramatic performance gains and
cost savings. These systems are designed for HPC, AI training,
rendering, and VDI workloads.
Universal GPU Servers – These are the most powerful
servers for large-scale AI training and large language models.
Open, modular, standards-based servers that provide superior
performance and serviceability with GPU options, including the
latest PCIe, OAM, and NVIDIA SXM technologies.
New Multi-node Servers - High-density 2U4N systems
optimized for HPC, data center, financial services, manufacturing,
and scientific research applications. Front-accessible service
design allows cold-aisle serviceability with flexible I/O and drive
configurations.
* Compared to 4th Gen Intel Xeon Scalable Processors.
Based on architectural projections as of August 21, 2023, relative to the prior
generation. Your results may vary.
About Super Micro Computer, Inc.
Supermicro (NASDAQ: SMCI) is a global leader in
Application-Optimized Total IT Solutions. Founded and operating in
San Jose, California, Supermicro
is committed to delivering first to market innovation for
Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are
a Total IT Solutions manufacturer with server, AI, storage, IoT,
switch systems, software, and support services. Supermicro's
motherboard, power, and chassis design expertise further enable our
development and production, enabling next generation innovation
from cloud to edge for our global customers. Our products are
designed and manufactured in-house (in the US, Taiwan, and the
Netherlands), leveraging global operations for scale and
efficiency and optimized to improve TCO and reduce environmental
impact (Green Computing). The award-winning portfolio of Server
Building Block Solutions® allows customers to optimize
for their exact workload and application by selecting from a broad
family of systems built from our flexible and reusable building
blocks that support a comprehensive set of form factors,
processors, memory, GPUs, storage, networking, power, and cooling
solutions (air-conditioned, free air cooling or liquid
cooling).
Supermicro, Server Building Block Solutions, and We Keep IT
Green are trademarks and/or registered trademarks of Super Micro
Computer, Inc.
All other brands, names, and trademarks are the property of
their respective owners.
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