Agreement builds on existing collaboration
between the two companies for the joint development of 2nm node
technology
TOKYO, June 3, 2024
/PRNewswire/ -- Rapidus Corporation, a manufacturer of
advanced logic semiconductors, and multinational technology company
IBM (NYSE: IBM), today announced a joint development partnership
aimed at establishing mass production technologies for chiplet
packages. Through this agreement, Rapidus will receive packaging
technology from IBM for high-performance semiconductors, and the
two companies will collaborate with a goal of further innovating in
this space.
This agreement is part of an international collaboration within
the framework of the "Development of Chiplet and Package Design and
Manufacturing Technology for 2nm-Generation Semiconductors" project
being conducted by Japan's New
Energy and Industrial Technology Development Organization (NEDO)
and builds on an existing agreement with IBM for the joint
development of 2nm node technology. As part of the agreement, IBM
and Rapidus engineers will work in collaboration at IBM's
facilities in North America for
R&D and manufacturing of semiconductor packaging for
high-performance computer systems.
Over the years, IBM has accumulated R&D and manufacturing
technologies for semiconductor packaging for high-performance
computer systems. The company also has a wealth of experience with
joint development partnerships with Japanese semiconductor
manufacturers, as well as manufacturers of semiconductors, package
manufacturing equipment, and materials. Rapidus aims to leverage
this expertise to quickly establish cutting-edge chiplet packaging
technology.
Rapidus President and CEO Dr. Atsuyoshi
Koike commented: "Building on our current joint development
agreement for 2nm semiconductor technology, we are extremely
pleased to officially announce today this partnership with IBM to
establish chiplet packaging technology. We will make the most of
this international collaboration and pursue initiatives that will
allow Japan to play an even more
important role in the semiconductor packaging supply chain."
Darío Gil, SVP and Director of Research at IBM, said: "With
decades of innovation in advanced packaging, IBM is honored to
expand our collaboration with Rapidus to develop state-of-the-art
chiplet technology. Through our agreement, we are committed to
supporting the development of the most advanced node production
processes, design, and packaging, as well as developing new use
cases and supporting the semiconductor workforce."
About IBM
IBM is a leading provider of global hybrid cloud and AI, and
consulting expertise. We help clients in more than 175 countries
capitalize on insights from their data, streamline business
processes, reduce costs and gain the competitive edge in their
industries. More than 4,000 government and corporate entities in
critical infrastructure areas such as financial services,
telecommunications and healthcare rely on IBM's hybrid cloud
platform and Red Hat OpenShift to affect their digital
transformations quickly, efficiently and securely. IBM's
breakthrough innovations in AI, quantum computing,
industry-specific cloud solutions and consulting deliver open and
flexible options to our clients. All of this is backed by IBM's
legendary commitment to trust, transparency, responsibility,
inclusivity and service. Visit ibm.com for more information.
About Rapidus
Rapidus Corporation aims to develop and manufacture the world's
most advanced logic semiconductors. By developing and providing
services to shorten cycle times for design, wafer processes, 3D
packaging, and other aspects of semiconductor production, Rapidus
creates new industries together with customers. We continue to
embrace challenges that contribute to the fulfillment, prosperity,
and happiness of people's lives using semiconductors.
Media contacts:
Kreab K.K. (Japan)
Kunihiko Yasue, Kreab
E-mail: kyasue@kreab.com
Takano Okumoto, Kreab
E-mail: tokumoto@kreab.com
Miki Yagi, Kreab
E-mail: myagi@kreab.com
Breakaway Communications (U.S.)
Devan Gillick,
rapidus@breakawaycom.com
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SOURCE Rapidus Corporation