HIW Hiwave Tech

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Hiwave Technologies PLC

24 May 2012

24 May 2012

HiWave Technologies plc

HiWave's power-efficient Bluetooth audio module cuts wireless speaker development time

Cambridge, UK, May 24, 2012:HiWave Technologies (LSE:HIW), which develops and sells electronic components and devices that utilise innovative sound and touch technologies, announces the DyadBA3 module to enable consumer audio product designers and manufacturers to rapidly introduce power-efficient, Bluetooth-streaming stereo loudspeakers to global markets. The module significantly extends battery life in small-format, portable wireless speakers.

Combining HiWave's HiAS2002 Audium amplifier chip with CSR's BC-05 Bluetooth technology, the DyadBA3 supports AVRCP and A2DP Bluetooth audio profiles and delivers two channels of 13W burst power output into 8-ohm speaker drive units. aptX(R) and HSP (headset) profile support is in development.

The HiAS2002 extends battery life by up to 20 times at normal listening levels, compared with Class-D amplifiers. The amplifier's envelope-tracking technology eliminates clipping at high audio levels, ensuring clear sound at all volumes.

The DyadBA3 module may be entirely powered from a single lithium-ion or lithium polymer battery. It incorporates circuitry for charging from a USB host or AC power adapter.

HiWave's Audium audio processing includes multi-step volume control at 1.5dB per step, a mute function with adjustable ramping, and 16 user-definable bi-quad filters for implementing equalisation, voicing, tunable bass extension and stereo-wide effects. The DyadBA3 module self-configures on power-up and invokes power-saving modes when no audio signal is present. It incorporates a stereo microphone input, making it also suitable for desktop or portable VoIP-phone audio portal applications.

Sized 110 x 46 x 25mm, the DyadBA3 module makes an ideal front-end to HiWave's patented BMR (Balanced Mode Radiator) speaker drive units. Pairing the module with two HIBM36S12 BMRs creates a compact, fully portable Bluetooth stereo speaker capable of delivering room-filling sound. For greater volume and frequency range, a pair of HiWave's new HIBM36S05 BMRs will deliver an even higher level of full-range, widely dispersed sound.

James Lewis, HiWave's CEO commented:

"With many of our customers seeking rapid entry into the wireless audio market, and the widespread availability of Bluetooth audio streaming smartphones, tablets and computers, we are delighted that our DyadBA3 and BMR solutions give them the opportunity of rapid product development, with the ability of voicing the product to their signature sound requirements. We continue to extend the capability of our Audium amplifier chip platform, and will shortly be demonstrating Volume Overdrive which boosts audio power output by a further 9.5dB."

HiWave is sampling its key customers now, and the DyadBA3 module will be available in mass production quantities in August.

Ends

 
 HiWave Technologies plc        +44 (0)1223 598 490 
 James Lewis 
  http://www.hiwave.com 
 
 Media enquiries                +44 (0)1225 470 000 
 Publitek Limited 
  Bob Jones or Rob Ashwell 
  Email: hiwave@publitek.com 
 
 Financial media enquiries      +44 (0)20 7831 3113 
 FTI Consulting 
  Sophie McMillan 
  Clare Thomas 
 

About HiWave

HiWave Technologies develops and sells electronic components and devices with innovative sound and touch technologies to add outstanding user appeal to consumer electronics.

HiWave's audio amplifier chips and modules are as much as 20 times more efficient than other sound technologies and its loudspeaker drivers create extremely high quality sound using bending wave technology. HiWave's patented haptic 'touch' technologies can transform a flat screen on a smartphone or tablet computer so that the user can feel the switch or click of a keypad but without any moving parts.

This information is provided by RNS

The company news service from the London Stock Exchange

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