FormFactor Introduces High Throughput Panel Metrology and Inspection System for Advanced Packaging
31 Mayo 2023 - 3:05PM
FormFactor, Inc. (NASDAQ:FORM), a leading semiconductor test and
measurement supplier, today introduced the FRT MicroProf® PT, a new
semiconductor metrology and inspection tool for rectangular panels
up to 600mm containing 4-5X more dies compared to a 300mm wafer.
With full automation and hybrid metrology capabilities, a single
system can perform multiple types of 3D measurements and defect
detection on the large format panels, supporting heterogenous
integration of chiplets used in advanced package technologies such
as fan-out panel-level packaging (FoPLP).
FoPLP and other advanced package techniques stack several
semiconductor dies into a single heterogeneous package using
connection elements such as microbumps, TSVs (through-silicon
vias), and interposers. In device development, the new MicroProf PT
with SurfaceSens™ technology incorporates a variety of
high-precision sensor options to measure the shape of these
inter-die connections, as well as thickness, roughness and other
characteristics of the film and metal layers that make up each
device. Fully integrating into factory floor automation with
SECS/GEM protocols, the tool can also deliver essential defect
inspection data for process control and yield improvement.
The MicroProf PT is the latest addition to FormFactor’s Advanced
Packaging metrology product family, complementing its established
wafer-level packaging product, the MicroProf AP. Its key features
include:
- Metrology and defect inspection applications in one tool
- Full automation with two loaders for panel FOUPs, for panels up
to 600mm x 600mm
- Multi-sensor setup including topography, field-of-view and film
thickness with hybrid software evaluation to evaluate highly
complex structures
- Film thickness measurements from micron-range down to tens of
nanometers
- Wide range of handling capability – from substrates a few
millimeters thick to 200µm, including organic and glass
“Innovation in advanced packaging is rapidly advancing process
capability, with large-format panel substrates providing an
important cost-reduction trajectory,” said Thomas Fries, Vice
President and General Manager of FormFactor’s Emerging Growth
Business Unit. “The multi-sensor MicroProf PT gives our customers
the flexibility to use the tool in both development and production
of these new processes on cost-effective panels.”
To learn more about FormFactor’s MicroProf PT tool and other
metrology products, visit
https://www.formfactor.com/products/metrology.
About FormFactorFormFactor, Inc. (NASDAQ:FORM),
is a leading provider of essential test and measurement
technologies along the full IC life cycle – from metrology and
inspection, characterization, modeling, reliability, and design
debug, to qualification and production test. Semiconductor
companies worldwide rely upon FormFactor’s products and services to
accelerate profitability by optimizing device performance and
advancing yield knowledge. FormFactor’s leading-edge probe
stations, probes, probe cards, optical metrology and inspection,
advanced thermal subsystems, and quantum cryogenic systems deliver
precision accuracy and superior performance. For more information,
visit the Company’s website at www.formfactor.com.
Trade ContactDavid VieraCorporate
Communications(925) 290-4182david.viera@formfactor.com
Investor ContactStan FinkelsteinInvestor
Relations(925) 290-4321ir@formfactor.com
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/8fc0bbd0-df73-4117-b15d-e9adecee3e6c
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