NEC Selects NXP RF Airfast Multi-chip Modules for Massive MIMO 5G Antenna Radio Unit for Rakuten Mobile in Japan
12 Octubre 2020 - 6:00PM
NXP® Semiconductors N.V. (NXP; NASDAQ: NXPI) and NEC Corporation
(NEC; TSE: 6701) today announced that NEC selected NXP to supply RF
Airfast multi-chip modules to be used in a Massive MIMO 5G antenna
Radio Unit (RU) for Rakuten Mobile, one of Japan’s leading mobile
network operators.
NEC’s Massive MIMO 5G antenna RU features a 5G open virtual
radio access network (vRAN) interface and has been adopted by
Rakuten Mobile for its fully virtualized cloud-native mobile
network. The RU utilizes extremely accurate digital beam forming
for efficient high-capacity transmission and is easy to install as
a result of miniaturization achieved through an increased level of
circuit integration.
NXP’s new AFSC5G40E38 RF Airfast multi-chip module was developed
to meet the frequency and power requirements of Japan’s 5G
infrastructure deployment. The device is part of an expanding
portfolio of NXP RF Airfast multi-chip modules being developed to
enable 5G infrastructure deployments throughout the world. NXP’s RF
Airfast multi-chip modules offer a common footprint across
frequency and power for different regions, enabling faster time to
market for network mobile operators.
NEC teamed up with Rakuten Mobile to develop and manufacture the
5G infrastructure that leverages NXP’s RF Airfast multi-chip
modules.
“NXP 5G RF Airfast multi-chip modules support the frequencies
and power levels needed for Japan’s 5G infrastructure,” said
Kazushi Tsuji, Deputy General Manager of NEC’s Wireless Access
Solutions Division. “The technology’s flexibility, integration and
performance allow us to quickly and effectively develop radio
products for 5G infrastructure. We’re pleased to partner with both
Rakuten and NXP to drive the 5G experience for end-users.”
“At NXP, we always strive for technological leadership,” said
Paul Hart, Executive Vice President and General Manager of NXP’s
Radio Power Division. “This partnership underscores our vision to
deliver advanced 5G experiences to countries around the world.
NXP’s Airfast multi-chip modules offer high levels of integration,
ease of use and performance for 5G infrastructure systems. No
matter what frequency band or power.”
About NECNEC Corporation has established itself
as a leader in the integration of IT and network technologies while
promoting the brand statement of “Orchestrating a brighter world.”
NEC enables businesses and communities to adapt to rapid changes
taking place in both society and the market as it provides for the
social values of safety, security, fairness and efficiency to
promote a more sustainable world where everyone has the chance to
reach their full potential. For more information, visit NEC at
http://www.nec.com.
About NXP SemiconductorsNXP Semiconductors N.V.
enables secure connections for a smarter world, advancing solutions
that make lives easier, better, and safer. As the world leader in
secure connectivity solutions for embedded applications, NXP is
driving innovation in the automotive, industrial & IoT, mobile,
and communication infrastructure markets. Built on more than 60
years of combined experience and expertise, the company has
approximately 29,000 employees in more than 30 countries and posted
revenue of $8.88 billion in 2019. Find out more at www.nxp.com.
NXP, Airfast, and the NXP logo are trademarks of NXP B.V. All
other products or service names are the property of their
respective owners. All rights reserved. © 2020 NXP B.V.
For more information, please
contact:
Americas
& Europe |
Japan |
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Jason
Deal |
Kiyomi Masuda |
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Tel: +44 771-522-8414 |
Tel: +81-50-3823-7031 |
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Email: jason.deal@nxp.com |
Email: kiyomi.masuda@nxp.com |
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NXP-MobileNXP-Comms
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/805faf7a-95ff-46c9-abb6-ca1e474a46c4.
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