- Fueled by heightened demand for the fastest data rates,
optical I/O module power requirements push traditional forced-air
cooling to operational limits
- Shift to 224 Gbps PAM-4 interconnects creates nearly a 4X
increase in power density, increasing thermal management costs and
complexities
- Advancements in server and optical module thermal management
encompass advanced liquid cooling solutions and new drop down heat
sink (DDHS) technology
LISLE,
Ill., May 21, 2024 /PRNewswire/
-- Molex, a global electronics leader and connectivity
innovator, has published a report that examines thermal
management pitfalls and possibilities as data center architects and
operators strive to balance high-speed data throughput requirements
with the impacts of growing power density and the need for heat
dissipation on critical servers and interconnect systems.
Molex's In-Depth Report of Thermal Management Solutions for I/O
Modules addresses the limitations of legacy approaches for
thermal characterization and management and explores new
innovations in server and optical module cooling to better support
112G and 224G connectivity.
"As demand for faster, more efficient data processing and
storage continues to rise rapidly, so does the heat generated by
the high-performance servers and systems needed to scale generative
AI applications and support the transition from 112 Gbps PAM-4 to
224 Gbps PAM-4," said Doug Busch, VP
& GM, Enabling Solutions Group, Molex. "The integration of
optical connectivity and optical modules, applied with new cooling
technologies, will optimize airflow and thermal management within
next-gen data centers. Molex is driving innovations in thermal
management across both copper and optical platforms, as well as
within our power management products, to help our customers improve
system cooling capabilities and enhance energy efficiency within
next-gen data centers."
Shift to 224 Gbps PAM-4 Shines Light on Creative Liquid
Cooling
The move to 224 Gbps PAM-4 interconnects between
servers and network infrastructure represents a doubling of the
per-lane data rate. Power consumption is also surging, with optical
modules alone reaching as high as 40W over long-range coherent
links, up from 12W just a few years ago, representing nearly a 4X
increase in power density.
In this informative report, Molex explores the latest in air
cooling, along with the integration of creative liquid cooling
solutions within existing form factors to address increased power
and thermal demands on I/O modules. Direct-to-chip liquid cooling,
immersion cooling and the role of passive components to enhance
active cooling are addressed. The report also delineates cooling
methods that may be most effective for accommodating power demands
in chips and I/O modules that scale to high levels.
To solve persistent challenges in cooling pluggable I/O modules,
Molex features a liquid cooling solution, called the integrated
floating pedestal. In this scenario, each pedestal that contacts
the module is spring-taught and moves independently, allowing
implementation of a single cold plate to different 1xN and 2xN
single row and stacked cage configurations. For example, this
solution for a 1x6 QSFP-DD module utilizes six independently
moving pedestals which can compensate for varying port stack
heights while ensuring seamless thermal contact. As a result, heat
flows directly from the module generating heat to the pedestal over
the shortest possible conduction path to minimize thermal
resistance and maximize heat transfer efficiency.
Additionally, the Molex report outlines the inherent costs and
risks associated with immersion cooling, which offers highly
effective thermal cooling that exceeds roughly 50kW per rack but
requires a complete overhaul of a data center's architecture.
Molex Drop Down Heat Sink (DDHS) Technology
Beyond
liquid cooling, Molex's In-Depth Report of Thermal Management
Solutions for I/O Modules details advanced approaches to module
design and thermal characterization poised to transform the
performance of high-speed network interconnects. For I/O
specifically, new solutions can be integrated into servers and
switches for greater levels of heat sinking without compromising
reliability. To that end, the report describes an innovative Molex
Drop Down Heat Sink (DDHS) solution that maximizes heat transfer
capability of a traditional riding heat sink while minimizing
metal-to-metal contact, which can create wear-and-tear on
components.
Through the DDHS, Molex replaces current riding heat sinks with
a solution that eliminates direct contact between the optical
module and thermal interface material (TIM) for a simpler and more
durable installation without friction or piercing. As a result,
Molex's DDHS allows successful TIM implementation for more than 100
insertion cycles. This reliable heat management solution fits
within standard module and rackmount form factors while effectively
cooling higher power modules and improving overall power
efficiency.
Future of Optical Module Cooling
As an active
participant in the Open Compute Project (OCP) and its Cooling
Environments project, Molex is collaborating with other
industry leaders to develop next-gen cooling technologies that meet
the evolving thermal management needs of today's most demanding
data center environments.
About Molex
Molex is a global electronics leader
committed to making the world a better, more connected
place. With presence in more than 40 countries, Molex
enables transformative technology innovation in the automotive,
data center, industrial automation, healthcare, 5G, cloud and
consumer device industries. Through trusted customer and industry
relationships, unrivaled engineering expertise, and product quality
and reliability, Molex realizes the infinite potential
of Creating Connections for Life. For more information,
visit www.molex.com.
View original content to download
multimedia:https://www.prnewswire.com/news-releases/molex-releases-report-on-thermal-management-challenges-and-opportunities-for-io-modules-amid-emerging-solutions-for-next-gen-data-center-cooling-302150807.html
SOURCE Molex Incorporated