QP Technologies™ Expands Die Preparation Business
19 Junio 2024 - 8:00AM
QP Technologies™, a leading provider of innovative microelectronic
packaging and assembly solutions, today announced it has added a
state-of-the-art dicing saw to its manufacturing line, expanding
its die and wafer preparation business. The Disco DFD6362, QP
Technologies’ first fully automated dicing system, enables a full
cassette of 300mm wafers to be processed quickly and efficiently,
improving turnaround time and productivity for client projects.
Further extending its wafer prep proficiencies, the company
recently installed an additional die sorter, a Royce Autoplacer MP
300, enabling precise, mechanized, non-surface-contact
pick-and-place of die during assembly.
The new Disco DFD6362 tool delivers about 7% higher throughput
compared to existing equipment under the same conditions, thanks to
its higher dual-cut processing speed and improved X-axis processing
feed speed. The tool’s automated flow smoothly moves workpieces
between the cassette, the chuck table (for cutting), and the
spinner table (for cleaning and drying). The tool quickly and
efficiently cuts narrower streets, enabling customers to fit more
die onto their costly wafers, increasing throughput and speeding
time to market for their devices.
“We are seeing heightened demand for our die preparation
services as customers are building die on larger wafers,” said Ken
Molitor, QP Technologies’ chief operating officer. “As a longtime
Disco customer, we selected the DFD6362 not only for its ability to
handle 300mm wafers in high volumes, but also its improved quality
and precision. We are excited at the new opportunities we see on
the horizon for our full complement of services.”
The U.S. CHIPS and Science Act and other government-funded
technology programs are fueling reshoring of semiconductor
manufacturing by establishing the innovation ecosystem needed to
optimize new chip fabrication facilities. As chipmakers build and
bring these new, high-volume fabs online, they will be seeking
U.S.-based companies that can deliver wafer prep, packaging and
assembly. With its proven capabilities, team of skilled experts,
and broadened equipment line, QP Technologies is well positioned to
play an even more vital role in this new ecosystem.
Visit QP Technologies in booth 842 at Sensors Converge, June
24-26, 2024, at the Santa Clara Convention Center to learn about
the company’s full portfolio of wafer preparation, packaging and
assembly, and substrate development capabilities, and their
application for a range of device types, including MEMS and
sensors. At the conference, David Fromm, COO of QP Technologies’
parent company Promex Industries, will give a presentation titled
“Design Considerations for Building Heterogeneously Integrated
Devices” on Tuesday, June 25, 2:40-3:00 p.m., in Grand Ballroom
G.
About QP TechnologiesEscondido, Calif.-based QP
Technologies (formerly Quik-Pak), a division of Promex Industries,
provides wafer preparation, IC packaging and assembly, and
substrate design and fabrication services in its wholly owned,
20,000-square-foot ISO 9001:2015/ISO-13485:2016-certified,
ITAR-registered facility. The company’s over-molded QFN/DFN
packages and pre-molded air-cavity QFN packages offer a fast,
convenient solution for customer needs ranging from prototype to
small-volume production. Same-day assembly services reduce
customers’ time to market, while advanced assembly services can
accommodate such structures as flip-chip, stacked die, SiP,
chiplets, MCM and CoB. For more information, visit
https://www.qptechnologies.com/, or call 858-674-4676.
Media Contacts:Lisa
Gillette-MartinKiterocketlgmartin@kiterocket.com408-205-4732 |
Matt HansenQP
Technologiesmhansen@qptechnologies.com408-202-7153 |
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/2cecc227-ba44-4abd-87e4-de27b42ca1c9