A Mezzanine Array Connector Family featuring High-Speed +
Power within a pitch 0.5 & 0.6mm enabling the highest DP
density and best performance in the Industry!
SAN
JOSE, Calif., June 20,
2024 /PRNewswire/ -- Neoconix today announced
immediate availability of the ultra-dense C-Beam "Mini" (CBM) and
SPH3 "Ultra" board to board array connectors enabled by C-Beam™
technology. Capable of supporting 112Gbps data rates with offered
pitches of 0.5mm and 0.6mm.
The CBM "mini" & SPH3 "Ultra" Product Families maintain the
PCBeam™ historic design flexibility & manufacturing benefits,
while integrating our new C-Beam technology to redefine
cutting-edge in Compression array -mezzanine interconnect. CBM and
SPH3 connectors offer ultra-low profile mated heights of 1.3mm
& 1.1mm respectively.
C-Beam™ technology is an extension of PCBeam™ technology
specifically developed for ultra-dense pitches down 0.4mm and
high-speed applications up to 112Gbps. The large pin counts offered
enable the combining of numerous high speed differential pairs,
power and signals in one connector.
C-Beam construction allows up to 40% reduction in pitch as
compared to PCBeam. Like PCBeam technology, the C-Beam offerings
are available with extensive customizability.
Offered in low-profile LGA/LGA format, implementations include
onboard optical modules, high speed Board to Board connections, and
other interconnects requiring high speed and low profile.
The Neoconix CBM "mini" connector family provides 84 and 128
position counts at 0.6mm and 0.5mm pitch respectively within a
standard configuration size less than the diameter is a US Dime
coin.
The Neoconix SPH3 connector family provides six offerings with
three configurations (Large, Med. & Small) in 2 pitches (0.5mm
& 0.6mm), with pin counts ranging from 408 positions to 840
positions.
"Neoconix is proud to be a leading innovator in z-axis
compression, mezzanine array interconnect solutions" said
Fred Hooper, Business Development
Manager for Neoconix. "The ability to offer a one-piece solution
supporting both high-speeding signaling and useful power is what
sets Neoconix apart from competition."
- CBM-XB128A, 128Pos, 0.5mm pitch
- SPH3-SB408A, 408Pos, 0.5mm pitch
- SPH3-MD480A, 480Pos, 0.6mm pitch
- SPH3-LB600A, 600POS, 0.6mm pitch
- CBM-XB084A, 84POS, 0.6mm pitch
- SPH3-SB560A, 560POS, 0.5mm pitch
- SPH3-MB672A, 672POS, 0.5mm pitch
- SPH3-LB8040A, 800POS, 0.5mm pitch
The CBM and SPH3 family of connectors is available today through
Neoconix and its sales representatives. Most solutions are stocked
to support sample quantities for immediate shipment.
In addition to its standard CBM and SPH3 connector solutions,
Neoconix will work with customers to define custom connectors if
their application requires it.
About Neoconix
Neoconix, Inc. is a premier supplier of high density, high
performance electrical connectors and interconnects. The company
leverages its advanced printed circuit board (PCB) processing
techniques to enable high-performance connectors at low cost.
Characterized by exceptional dimensional control at fine feature
sizes, Neoconix' s PCBeam™ technology is ideal for a broad set of
board-to-board, flex-to-board, and LGA socket applications.
Neoconix' s products and technologies are used in many markets,
including mobile electronics, telecommunications, computing, and
data centers. Additional information or samples may be obtained by
visiting our website at www.neoconix.com, or contacting the company
at sales@neoconix.com.
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SOURCE Neoconix, Inc.