SUNNYVALE,
Calif., June 24, 2024 /PRNewswire/ -- Baya Systems
and Blue Cheetah Analog Design today announced the availability of
a combined chiplet-optimized Network on Chip (NoC) and Physical
Layer (PHY) interconnect IP solution. Integrating Baya Systems'
WeaveIP™ NoC, and Blue Cheetah BlueLynx™ Die-to-Die (D2D)
PHY IP solves many of the
complexities of chiplet interconnect, greatly simplifying the
architecture and design process for chiplet-based systems.
Systems-on-chip (SoCs) have driven the rapid
growth in tightly integrated processing solutions needed for
today's complex, high-performance applications. An evolution of
SoCs, chiplet-based designs enable more cost-effective integration
of best-in-class subsystems at scale. Both approaches commonly use
a NoC to connect various subsystems. The NoC replaces dedicated
point-to-point connections with intelligent network infrastructure
across a chip or package, providing a more efficient interconnect
that eases design complexity. With chiplet-based designs, the
subsystems reside on various chiplets, which may come from
different foundries or process technologies but are packaged as
one. Each chiplet may have unique physical requirements but needs
to communicate efficiently with others, which requires robust D2D
PHY interconnect solutions.
"Almost all modern SoC designs use Networks on
Chip (NoCs) to move data between heterogeneous computing elements.
Multi-die implementations introduce another layer of complexity to
fabric and cache architecture," said Nitin
Dahad, Editor-in-Chief of embedded.com and EE Times
correspondent. "Overcoming these complexities with a combined NoC
and Physical Layer (PHY) to address the challenges of latency,
bandwidth, and throughput could pave the way for a more efficient
and optimized chip design and support the growth of a chiplet-based
economy that many system developers and integrators would benefit
from."
While chiplets simplify individual subsystems,
chiplet-based designs can be substantially more complex. To solve
this, Baya Systems' WeaverPro™ software provides a data-driven
platform that algorithmically optimizes designs from concept to
post-silicon tuning. This enables SoC designers to extend their
skills to create a chiplet-ready system architecture that is
globally and locally optimized. Baya also offers Cache Studio,
which enables system architects to develop optimal memory and cache
architectures, and Fabric Studio, which allows designers to create
data-driven system microarchitecture with its unified fabric,
optimized with cycle-accurate simulation of actual workloads.
"Baya's platform designs the subsystems at a
digital level, and combining it with Blue Cheetah's PHY connects
them physically," said Sailesh
Kumar, CEO of Baya Systems. "In partnership, we provide
system architects with a state-of-the-art platform and powerful
tools to create the most innovative and cost-effective
chiplet-based products."
"Blue Cheetah and Baya Systems share a common
vision to advance chiplet-based development by providing highly
optimized, fully customizable interconnect solutions," said
Elad Alon, CEO of Blue Cheetah.
"Customers need the capability to tailor solutions for specific
applications and workloads. At the same time, they want to reap the
advantages of working within the context of industry standards. Our
solutions deliver on both, offering standards-based
customizability."
Blue Cheetah's BlueLynx interconnect IP provides
D2D PHY and link layer interfaces and supports Universal Chiplet
Interconnect Express (UCIe) and Open Compute Project (OCP) Bunch of
Wires (BoW) standards. BlueLynx connects to on-die buses and NoCs
with various standards, including AMBA® 4 CHI, AXI, and
ACE. Blue Cheetah interconnect IP solutions are being delivered
today using many advanced process technologies across multiple
foundries and supporting standard and advanced packaging
technologies.
About Blue Cheetah Analog Design
Blue Cheetah provides customizable
standards-based die-to-die interconnect solutions for chiplets. Its
state-of-the-art semiconductor IP solutions are process-adaptable
and customizable to achieve industry-leading power, performance,
and area for high-performance computing, AI/ML, networking, mobile,
and many other applications. The company's BlueLynx platform
provides chip makers the fastest, lowest-risk path to
application-optimized chiplet interconnect solutions. Blue Cheetah
was founded in 2018 and is headquartered in Sunnyvale, California. Visit
https://www.bcanalog.com/.
About Baya Systems
Baya Systems provides software platforms and
unique fabric IP components that create advanced, single-die or
multi-die, chiplet-ready systems for Intelligent Compute. Its
WeaverPro software and WeaveIP fabric and cache portfolio enables
system architects to analyze and develop optimal system solutions
for hyperscale, enterprise, AI, Automotive, GPU and IoT markets.
WeaveIP is the industry's first IP portfolio to support both
multi-level coherency for large scale coherent clusters and
multicast capabilities for AI accelerations that can support
throughputs scaling into PetaBytes/second. Baya Systems is backed
by Matrix Ventures and Intel Capital and has offices in
Santa Clara, CA, Austin, TX, and Bengaluru India. For more
information, visit https://www.bayasystems.com or contact
pr@bayasystems.com
Media Contact:
Blue Cheetah Analog Design
Pauline Shulman
415-375-0303
379483@email4pr.com
Baya Systems:
379483@email4pr.com
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SOURCE Blue Cheetah Analog Design; Baya Systems