MOUNTAIN VIEW, Calif.,
Feb. 1, 2012 /PRNewswire/
-- CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor
of silicon intellectual property (SIP) platform solutions and DSP
cores, today announced the availability of a new silicon-based,
software development kit (SDK) for runtime software development
based on the CEVA-XC323 DSP architecture. The CEVA-XC323 silicon
embedded in the SDK was designed by CEVA and manufactured on a 65nm
process, delivering up to 800MHz performance. This level of
performance facilitates the design of software-based modems and
associated application software, for multiple communication
standards, in parallel and in a real-time environment. The SDK
platform was defined in collaboration with a Tier 1 handset OEM and
is already in use with CEVA customers and partners.
The CEVA-XC SDK enables the full implementation of the physical
layer (PHY) signal processing in software for a range of
communication standards, including LTE, LTE-Advanced, HSPA+, HSPA,
TD-SCDMA, WiFi, DTV demodulation, digital radio, and GPS. The SDK
is comprised of the CEVA-XC323 silicon, including CEVA's innovative
Power Scaling Unit (PSU) which enables advanced power management
within the SoC, a comprehensive set of optimized DSP software
libraries, and a broad range of standard interfaces, enabling easy
integration into customer-specific system designs. The kit also
includes complete debug, profiling and tracing capabilities in
real-time, to enable the modeling of real system conditions well in
advance of customer silicon being available. The development kit is
supported by CEVA-Toolbox™, a complete software development, debug,
and optimization environment.
"Our CEVA-XC silicon-based software development kit
significantly accelerates software-defined modem design and
development by our customers and partners and enables the full
validation of their designs in real-time before taping-out their
silicon," said Eran Briman, vice
president of marketing at CEVA. "This fundamentally reduces the
cost, risk and design efforts associated with supporting
still-evolving standards and bringing multi-mode communication
designs to production silicon for our customers."
The development kit includes: 6.5Gbps optical transceiver, dual
port 1Gbps Ethernet, 1GB of DDR2 memories, 64MB SSRAM memories,
HDMI in/out ports, dual Serial Rapid IO transceivers, and multiple
large FPGA modules open for user programmability to add SoC
specific logic. The CEVA-XC323 silicon was manufactured in a 65nm
process and includes the CEVA-XC323 DSP, Power Scaling Unit (PSU),
two XC-DMA controllers, program cache, 512 KB L1 data and 1MB
shared L2 memory, external 64/128-bit AXI master and slave
interfaces, 32-bit master APB interface, multiple efficient
master/slave memory interfaces, Power Management Unit (PMU),
Timers, Interrupt Control Unit (ICU), GPIOs, and more.
Availability
The CEVA-XC SDK is available for purchase today. Contact your
local sales office or email info@ceva-dsp.com for more
information.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual
property (SIP) DSP cores and platform solutions for the mobile
handset, portable and consumer electronics markets. CEVA's IP
portfolio includes comprehensive technologies for cellular baseband
(2G / 3G / 4G), multimedia (HD video, Image Signal Processing (ISP)
and HD audio), voice over packet (VoP), Bluetooth, Serial Attached
SCSI (SAS) and Serial ATA (SATA). In 2011, CEVA's IP was shipped in
over 1 billion devices, powering handsets from 7 out of the top 8
handset OEMs, including Nokia, Samsung, LG, Motorola, Sony and ZTE.
Today, more than 40% of handsets shipped worldwide are powered by a
CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow
CEVA on twitter at www.twitter.com/cevadsp.
SOURCE CEVA, Inc.