VSMC Celebrates Breaking Ground on 300mm Fab in Singapore
04 Diciembre 2024 - 12:00AM
VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), the
joint venture formed in September, 2024 by Vanguard International
Semiconductor Corporation (VIS, TPEx 5347) and NXP Semiconductors
N.V. (NXP, NASDAQ: NXPI) today celebrated breaking ground at the
site of the joint venture’s new 300mm wafer manufacturing facility
in Tampines, Singapore.
The groundbreaking ceremony was attended by customers,
suppliers, partners, association representatives, residents, and
government officials. Executives from VSMC, VIS and NXP were also
present to commemorate the start of construction on the new
facility, which is anticipated to begin initial production in 2027.
VSMC was also honored to have Dr. Tan See Leng, Minister for
Manpower and Second Minister for Trade and Industry, participate in
the ceremony.
“Singapore is renowned not only as Asia’s
economic hub but also as a beacon of technological innovation. We
are proud to announce the groundbreaking of our first 12-inch fab
in Singapore, which will uphold the company’s core business
philosophy, provide specialty IC foundry services, and lay the
foundation for our future development. This fab will advance the
semiconductor industry and bolster the local high-tech sector,”
said VSMC and VIS Chairman Leuh Fang. “Designed with modern
technology and guided by green manufacturing principles, the fab
reflects our firm commitment to the future. VSMC is dedicated to
being a responsible corporate citizen, supporting economic growth
while ensuring environmental sustainability.”
“I’m humbled and excited to see construction of
VSMC’s 300mm fab moving forward very swiftly,” said NXP President
and CEO Kurt Sievers. “NXP has enjoyed decades of successful
semiconductor manufacturing operations in Singapore, and the new
VSMC fab is entirely aligned with our differentiated hybrid
manufacturing strategy. This new fab will support NXP’s growth
plans with supply control and geographic resilience at competitive
cost.”
“We welcome the decision by VIS and NXP to jointly establish
VSMC and its greenfield 12-inch wafer fab in Singapore. This is
testament to Singapore’s attractiveness to global companies to site
advanced manufacturing activities, and reinforces Singapore’s
position as a critical global node in the semiconductor supply
chain. The new fab will not only create about 1,500 good jobs, it
will also facilitate business and partnership opportunities for
local enterprises,” said Ms Cindy Koh, Executive Vice President,
Singapore Economic Development Board. “Singapore will continue to
invest in talent development, R&D, and decarbonization
solutions to enhance our competitiveness and strengthen Singapore’s
semiconductor ecosystem.”
Construction of the VSMC fab is on-track, with initial
production slated to begin in 2027. Upon the successful ramp of the
initial phase, a second phase will be considered and developed
pending future business development by VIS and NXP. With an
expected output of 55,000 300mm wafers per month in 2029, the joint
venture will create approximately 1,500 jobs while contributing to
the development of the upstream and downstream supply chains,
contributing to Singapore and the global semiconductor
ecosystem.
The fab will adopt a fully automated production model,
integrating an Automated Material Handling System (AMHS) and
comprehensive quality management through Artificial Intelligence
applications. This will achieve fast, precise, high-yield, and
high-quality manufacturing excellence, providing customers with
competitive services and creating a smart fab in Singapore.
Addressing the company’s commitment to sustainability
stewardship, the fab will be constructed in accordance with
Singapore Green Mark standards and will incorporate rigorous green
manufacturing measures. To help minimize environmental impact, the
site will feature energy-efficient cooling and lighting systems,
high degree of process water recycling, and the use of eco-friendly
materials. In addition, several green office design principles will
be integrated, such as ample natural light, abundant communal
spaces, and lush greenery to foster and contribute to a culture of
wellness.
On June 5, VIS and NXP announced plans to establish the VSMC
joint venture in Singapore to build a 300mm wafer fab with a total
investment of approximately $7.8 billion. On September 4, VIS and
NXP announced the establishment of the VSMC joint venture, having
obtained all necessary regulatory approvals from relevant
authorities and injected capital to officially establish the VSMC
joint venture. The joint venture marks a significant step to
establishing geographic resilience and accelerating Singapore’s
semiconductor ecosystem.
About VISVanguard International
Semiconductor Corporation (VIS) is a leading specialty IC foundry
service provider. Since its inception in 1994 in Hsinchu Science
Park, Taiwan, VIS has been achieving continuous success in its
technology development and production efficiency improvement. VIS
has also been consistently offering its customers cost-effective
solutions and high value-added services. VIS has five 8-inch fabs
in Taiwan and Singapore with a monthly capacity of about 282,000
wafers in 2024. VIS has a total of over 6,000 employees. We are
committed to adhering to our customer-oriented business philosophy
to provide customers continuously improved and enhanced specialty
IC foundry services. To better serve our worldwide customers, VIS
has established sales offices in Taiwan and sales representatives
in main IC clusters around the world.
About NXP SemiconductorsNXP Semiconductors N.V.
is the trusted partner for innovative solutions in the automotive,
industrial & IoT, mobile, and communications infrastructure
markets. NXP's "Brighter Together" approach combines leading-edge
technology with pioneering people to develop system solutions that
make the connected world better, safer, and more secure. The
company has operations in more than 30 countries and posted revenue
of $13.28 billion in 2023. Find out more at www.nxp.com.
For further information, please contact:
VIS
Spokesperson: |
VIS
Public Relations: |
Amanda Huang |
Hui-Chung Su |
Vice President & CFO |
hcsuc@vis.com.tw |
pr@vis.com.tw |
886-3-5770355 #1901 |
886-3-5770355 |
|
|
|
NXP Investor Relations: |
NXP Public Relations: |
Jeff Palmer - Global |
Paige Iven – Americas and EU |
jeff.palmer@nxp.com |
paige.iven@nxp.com |
+1 408 205 0687 |
+1 817 975 0602 |
|
|
|
Jenny YC Chen – Asia Pacific |
|
jenny.yc.chen@nxp.com |
|
|
NXP-CORP
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/cc4291a3-022b-4f09-8e09-e15357e5b15b
NXP Semiconductors NV (NASDAQ:NXPI)
Gráfica de Acción Histórica
De Nov 2024 a Dic 2024
NXP Semiconductors NV (NASDAQ:NXPI)
Gráfica de Acción Histórica
De Dic 2023 a Dic 2024