Global 1 Features the First CMOS Power
Amplifier to Deliver GaAs-Level Performance for LTE Devices
Peregrine Semiconductor Corp. (NASDAQ:PSMI), founder of RF SOI
(silicon on insulator) and pioneer of advanced RF solutions, today
announces UltraCMOS Global 1, the first reconfigurable RF front end
(RFFE). For the first time, 4G LTE platform providers and OEMs will
be able to save time and money by creating a single-SKU design for
global markets.
To support over 40 frequency bands and a more than 5,000-fold
increase in the number of possible operating states, a truly
reconfigurable RFFE is now a requirement. This level of
reconfigurability is only feasible with a CMOS process. Global 1’s
entire system – multimode, multiband (MMMB) power amplifier (PA);
post-PA switch; antenna switch; and antenna tuner – is based on
Peregrine’s UltraCMOS 10 technology platform. This platform
leverages 25 years of RF expertise with proven performance
demonstrated by more than 2 billion RF SOI units shipped. In
addition, Global 1 features the industry’s first LTE CMOS PA with
the same raw performance as the leading gallium arsenide (GaAs) PAs
and has a 33-percent efficiency increase over other CMOS PAs.
“For years RF engineers have been looking for an integrated,
CMOS RF front-end offering that performs as well as GaAs for mobile
devices,” says Joe Madden, founder and principal analyst at Mobile
Experts. “Peregrine’s UltraCMOS technology has demonstrated
GaAs-level efficiency performance at high power, which could be a
game-changer.”
Global 1 RFFE System
On a single chip, Peregrine’s Global 1 RFFE system delivers the
scalability to easily support higher band counts through low-loss
switching and tunability; high isolation to solve interoperability
issues; simple, digitally-controlled adaptation across modes and
bands; and, most importantly, PA performance equivalent to
GaAs.
The UltraCMOS Global 1 system’s reconfigurable RFFE
delivers:
- 3-path MMMB PA, post-PA switching,
antenna switch and antenna tuner
- Support for envelope tracking
- Common RFFE MIPI interface
“Creating a global, single-SKU design for LTE devices is
currently the toughest, unmet challenge in RF,” says Jim Cable, CEO
at Peregrine Semiconductor. “Peregrine was founded with a vision
for integration, and, after shipping 2 billion switches and tuners,
we are proud to announce a truly integrated RF front-end system
that enables a single, global SKU.”
UltraCMOS Global 1 PA Performance
Before now, no vendor has been able to deliver GaAs-level PA
performance in a CMOS PA, which prevented CMOS PAs from competing
in the performance-driven LTE handset market. The Global 1 system
integrates Peregrine’s established, best-in-class RF switches and
tuners seamlessly with the first CMOS PA to match the performance
of GaAs PAs. This level of performance is reached without
enhancements from envelope tracking or digital predistortion, which
is often used when benchmarking CMOS PAs with GaAs PAs.
A standard industry benchmark for PA performance is PAE
(power-added efficiency) using a WCDMA (voice) waveform at an ACLR
(adjacent channel leakage ratio) of -38 dBc. Under these
conditions, the performance of the UltraCMOS Global 1 PA approaches
50-percent PAE. This is on par with the leading GaAs PAs and
exceeds the performance of other CMOS PAs by 10 percentage points,
which represents a 33-percent efficiency increase. Further, the
UltraCMOS Global 1 PA maintains GaAs-equivalent PAE for LTE
waveforms with varying resource-block allocations.
While the UltraCMOS Global 1 PA reaches GaAs-competitive
performance levels without the use of envelope tracking, the system
natively supports all major envelope tracking solutions currently
on the market. The PAE at saturated power (PSAT) provides a good
indication on what PAE is possible using an envelope tracking
modulator; however, the efficiency enhancements that envelope
tracking brings are very band specific. With an envelope tracker,
the system efficiency of UltraCMOS Global 1 typically increases 10
percentage points, depending on band.
UltraCMOS Global 1 Benefits Everyone
According to Mobile Experts, the RFFE market is projected to
grow from $6.1 billion in 2013 to $12.2 billion in 2018. Much of
this growth stems from demand in the LTE market and the impact the
RFFE has on the overall performance in mobile devices. The benefits
of Global 1 extend far beyond RF engineers to affect the entire
wireless ecosystem:
- Platform providers can develop a
single reference platform, reducing reference design development
costs and validation time.
- OEMs can design a single,
global SKU, cutting R&D costs, accelerating time to market,
streamlining supply chains and improving inventory management.
- Consumers can enjoy longer
battery life, better reception, faster data rates and wider roaming
range.
- Wireless operators can reduce
capital investments in their network with improved RFFE
performance, resulting in better coverage and reductions in dropped
calls.
UltraCMOS Global 1 Availability
The UltraCMOS Global 1 PA will be demonstrated by appointment at
Mobile World Congress (MWC) in Barcelona, Feb. 24-27, in
Hospitality Suite Meeting Room 2A20MR. The UltraCMOS Global 1
system will complete platform integration in 2014 and will be in
volume production in late 2015. For more detail, view the press
kit.
USE OF FORWARD-LOOKING STATEMENTS
This press release contains forward-looking statements regarding
our management's future expectations, beliefs, intentions, goals,
strategies, plans and prospects. Such statements constitute
“forward-looking” statements which are subject to the safe harbor
provisions of the Private Securities Litigation Reform Act of 1995.
The achievement of the matters covered by such forward-looking
statements involves risks, uncertainties and assumptions. If any of
these risks or uncertainties materialize or if any of the
assumptions prove incorrect, our actual results, performance or
achievements could be materially different from any future results,
performance or achievements expressed or implied by the
forward-looking statements. Such risks and uncertainties include,
but are not limited to, our dependence on a limited number of
customers for a substantial portion of our revenues; intellectual
property risks; intense competition in our industry; our ability to
develop and introduce new and enhanced products on a timely basis
and achieve market acceptance of those products; consumer
acceptance of our customers’ products that incorporate our
solutions; our lack of long-term supply contracts and dependence on
limited sources of supply; and potential decreases in average
selling prices for our products.
For further information regarding risks and uncertainties
associated with Peregrine’s business, please refer to the filings
that we make with the Securities and Exchange Commission from time
to time, including those set forth in the section entitled “Risk
Factors” in our Form 10-K for the year ended December 29, 2012 and
additional information that will be set forth in our Form 10-K that
will be filed for the year ended December 28, 2013, which should be
read in conjunction with these financial results. These documents
are available on the SEC Filings section of the Investor Relations
section of our website at http://investors.psemi.com/. Please also
note that forward-looking statements represent our management's
beliefs and assumptions only as of the date of this press release.
Except as required by law, we assume no obligation to update these
forward-looking statements publicly, or to update the reasons
actual results could differ materially from those anticipated in
the forward-looking statements, even if new information, becomes
available in the future.
ABOUT PEREGRINE SEMICONDUCTOR
Peregrine Semiconductor (NASDAQ:PSMI), founder of RF SOI
(silicon on insulator), is a leading fabless provider of
high-performance, integrated RF solutions. Since 1988 Peregrine and
its founding team have been perfecting UltraCMOS® technology – a
patented, advanced form of SOI – to deliver the performance edge
needed to solve the RF market’s biggest challenges, such as
linearity. With products that deliver best-in-class performance and
monolithic integration, Peregrine is the trusted choice for market
leaders in automotive, broadband, industrial, Internet of Things,
military, mobile devices, smartphones, space, test-and-measurement
equipment and wireless infrastructure. Peregrine holds more than
150 filed and pending patents and has shipped more than 2 billion
UltraCMOS units. For more information, visit
http://www.psemi.com.
The Peregrine Semiconductor name, logo, and UltraCMOS are
registered trademarks of Peregrine Semiconductor Corporation in the
U.S.A., and other countries. All other trademarks mentioned herein
are the property of their respective owners.
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Peregrine SemiconductorEditorial Contact:Elizabeth
Brown, 619.993.4648pr@psemi.comorInvestor Relations:Jonathan
Goldberg, 858.795.0161ir@psemi.comorMobile World Congress
Appointments:Kimberly Stoddard, 415.806.5793pr@psemi.com
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