Onto Innovation Launches U.S. Applications Center of Excellence Focused on Panel-Level Packaging
10 Julio 2023 - 6:30AM
Business Wire
Customers to receive early access to
cutting-edge capabilities allowing for reduced development time and
process optimized yield
Onto Innovation Inc. (NYSE: ONTO) today announced the launch of
an Applications Center of Excellence, a combined tool demonstrator,
photo resist qualification, process integration and research and
development (R&D) facility focused on panel-level packaging
(PLP), a key facilitator of the emerging chiplet market. The
chiplet package market is expected to grow at an annual average
rate of 103% over the next three years, according to TechSearch
International.
A first-of-its-kind facility dedicated to panel-level packaging,
the Applications Center of Excellence is located within Onto
Innovation’s Wilmington headquarters and will offer the company’s
PLP customers hands-on experience with Onto’s hardware and software
solutions, including the Firefly® sub-micron panel defect
inspection system, large exposure field JetStep® X500 lithography
system and Discover® family of software. Customers will also have
access to systems and processes offered by partnering OEMs and
materials providers. With access to these combined resources,
customers, collaborators and Onto team members will partner to
explore and refine advanced PLP processes.
“Our customers want to accelerate their technology roadmaps, and
we will assist them by leveraging our experience and access to
next-generation processes and equipment, from both Onto and our
partners. This collaborative approach to process development will
help our customers accelerate roadmaps and we expect this will
result in shortened time to yield when in production,” says Michael
Plisinski, chief executive officer of Onto Innovation.
With several significant industry inflection points on the
horizon, such as glass substrate and increasingly tighter
line/space requirements, the Applications Center of Excellence is
ideally suited for advanced packaging process development for PLP,
advanced IC substrates (AICS) and wafer-level packaging.
“The R&D phase is more important now than ever, especially
when it concerns PLP. By facilitating connections between Onto, our
customers and our collaborators, we will use this critical time to
craft turnkey solutions for build-up films, redistribution layers,
photoresists, copper clad laminate substrates and glass
substrates,” says Plisinski. “With the application of Onto’s smart
factory-enabling Yield Optimizer™ software, we can intelligently
bridge the gaps between fabrication and advanced packaging
processes, accelerating time to market for key process steps that
bring heterogeneously integrated chips, and chiplets to life.”
The Applications Center of Excellence further strengthens Onto’s
ability to capitalize on the rapid growth and technical
complexities of the chiplet market driven by high-performance
computing, GPU/CPU for AI and AR/VR, autonomous driving, and edge
computing.
Interested customers and potential partner organizations should
visit Onto Innovation during SEMICON® West at booth 629 or reach
out to their local sales and support team to learn how to initiate
collaboration at the Onto Applications Center of Excellence.
About Onto Innovation Inc.
Onto Innovation is a leader in process control, combining global
scale with an expanded portfolio of leading-edge technologies that
include: Un-patterned wafer quality; 3D metrology spanning chip
features from nanometer scale transistors to large die
interconnects; macro defect inspection of wafers and packages;
metal interconnect composition; factory analytics; and lithography
for advanced semiconductor packaging. Our breadth of offerings
across the entire semiconductor value chain combined with our
connected thinking approach results in a unique perspective to help
solve our customers’ most difficult yield, device performance,
quality, and reliability issues. Onto Innovation strives to
optimize customers’ critical path of progress by making them
smarter, faster and more efficient. With headquarters and
manufacturing in the U.S., Onto Innovation supports customers with
a worldwide sales and service organization. Additional information
can be found at www.ontoinnovation.com.
Forward Looking Statements
This press release contains forward-looking statements within
the meaning of the Private Securities Litigation Reform Act of 1995
(the “Act”) which include statements relating to Onto Innovation’s
business momentum and future growth; the benefit to customers and
the capabilities of Onto Innovation’s products and customer
service; Onto Innovation’s ability to both deliver products and
services consistent with our customers’ demands and expectations
and strengthen its market position, Onto Innovation’s beliefs about
market opportunities as well as other matters that are not purely
historical data. Onto Innovation wishes to take advantage of the
“safe harbor” provided for by the Act and cautions that actual
results may differ materially from those projected as a result of
various factors, including risks and uncertainties, many of which
are beyond Onto Innovation’s control. Such factors include, but are
not limited to, the Company’s ability to leverage its resources to
improve its position in its core markets; its ability to weather
difficult economic environments; its ability to open new market
opportunities and target high-margin markets; the strength/weakness
of the back-end and/or front-end semiconductor market segments;
fluctuations in customer capital spending; the Company’s ability to
effectively manage its supply chain and adequately source
components from suppliers to meet customer demand; the effects of
political, economic, legal, and regulatory changes or conflicts on
the Company's global operations; its ability to adequately protect
its intellectual property rights and maintain data security; the
effects of natural disasters or public health emergencies, such as
the current COVID-19 pandemic, on the global economy and on the
Company’s customers, suppliers, employees, and business; its
ability to effectively maneuver global trade issues and changes in
trade and export license policies; the Company’s ability to
maintain relationships with its customers and manage appropriate
levels of inventory to meet customer demands; and the Company’s
ability to successfully integrate acquired businesses and
technologies. Additional information and considerations regarding
the risks faced by Onto Innovation are available in Onto
Innovation’s Form 10-K report for the year ended December 31, 2022
and other filings with the Securities and Exchange Commission. As
the forward-looking statements are based on Onto Innovation’s
current expectations, the Company cannot guarantee any related
future results, levels of activity, performance or achievements.
Onto Innovation does not assume any obligation to update the
forward-looking information contained in this press release,
whether as a result of new information, future events or otherwise,
except as required by law.
Source: Onto Innovation Inc. ONTO-IC
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version on businesswire.com: https://www.businesswire.com/news/home/20230710207749/en/
Investor Relations: Michael Sheaffer, +1 978.253.6273
mike.sheaffer@ontoInnovation.com
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