Collaboration on TSMC's COUPE silicon
photonics platform dramatically speeds chip-to-chip and
machine-to-machine communication for cloud, datacenters, HPC, and
AI chips
/ Key Highlights
- Ansys and TSMC deliver a high-fidelity multiphysics solution to
address design challenges for artificial intelligence (AI),
datacenter, cloud, and high-performance computing (HPC) chips
- The combined effort covers a broad range of Ansys multiphysics
simulation solutions, including semiconductor, thermal,
electromagnetics, photonics, and optics
PITTSBURGH, April 24,
2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today
announced a collaboration with TSMC on multiphysics software for
TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a
cutting-edge Silicon Photonics (SiPh) integration system and
Co-Packaged Optics platform that mitigates coupling loss while
significantly accelerating chip-to-chip and machine-to-machine
communication.
TSMC COUPE, along with Ansys multiphysics solutions that are
integrated with Synopsys' 3DIC Compiler unified
exploration-to-signoff platform, enables the next generation
of silicon photonics and co-packaged optics designs for
applications in AI, datacenter, cloud, and HPC communications. The
work spans multiple areas, including fiber-to-chip coupling,
integrated electronic-photonic chip design, power integrity
verification, high-frequency electromagnetic analysis, and critical
thermal management.
TSMC COUPE integrates multiple electrical ICs with a photonic IC
and fiber optic connections into a single package. These include
Ansys Zemax™ for optical input/output simulation, Ansys
Lumerical™ for photonic simulation, Ansys RedHawk-SC™ and
Ansys Totem™ for multi-die power integrity signoff, Ansys
RaptorX™ to model high-frequency electromagnetic analysis
between dies, and Ansys RedHawk-SC Electrothermal™ for vital
thermal management of the multi-die heterogenous system.
Additionally, Lumerical allows custom Verilog-A models for
electronic photonic circuit simulations, which work seamlessly with
the TSMC Modeling Interface (TMI) and are co-designed with TSMC's
Process Design Kit (PDK).
"By providing a good silicon photonics integration system we can
address both critical issues of energy efficiency and computing
performance to support the explosive growth in data transmission
that comes with the AI boom," said Dan Kochpatcharin, head of the
design infrastructure management division at TSMC. "We have aligned
closely with our Open Innovation Platform® (OIP) partners like
Ansys to provide our customers with a solution to the design
challenges in this breakthrough technology, enabling their designs
to achieve a new level of performance and energy efficiency."
"Ansys' multiphysics platform for TSMC's COUPE technology
underscores our focus on delivering the most comprehensive
multiphysics portfolio with the best solution for every need," said
John Lee, vice president and general
manager of the semiconductor, electronics, and optics business unit
at Ansys. "Ansys is a leader in delivering a deep and broad
portfolio of integrated multiphysics simulation solutions and
platforms. Together, TSMC and Ansys are enabling the next wave of
technological innovation."
/ About Ansys
Our Mission: Powering Innovation that Drives Human
Advancement™
When visionary companies need to know how their world-changing
ideas will perform, they close the gap between design and reality
with Ansys simulation. For more than 50 years, Ansys software has
enabled innovators across industries to push boundaries by using
the predictive power of simulation. From sustainable transportation
to advanced semiconductors, from satellite systems to life-saving
medical devices, the next great leaps in human advancement will be
powered by Ansys.
Ansys and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS–T
/
Contacts
|
|
|
|
Media
|
Mary Kate
Joyce
|
|
724.820.4368
|
|
marykate.joyce@ansys.com
|
|
|
Investors
|
Kelsey
DeBriyn
|
|
724.820.3927
|
|
kelsey.debriyn@ansys.com
|
View original content to download
multimedia:https://www.prnewswire.com/news-releases/ansys-and-tsmc-enable-a-multiphysics-platform-for-optics-and-photonics-addressing-needs-of-ai-hpc-silicon-systems-302126678.html
SOURCE Ansys