JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel High-Performance Computing and AI
22 Julio 2024 - 9:00AM
Business Wire
JEDEC Solid State Technology Association, the global leader in
the development of standards for the microelectronics industry,
proudly announces upcoming standards for advanced memory modules
designed to power the next generation of high-performance computing
and AI applications. JEDEC today revealed key details about its
upcoming standards for DDR5 Multiplexed Rank Dual Inline Memory
Modules (MRDIMM) and a next-generation Compression-Attached Memory
Module (CAMM) for LPDDR6. The new MRDIMM and CAMM for LPDDR6 are
set to revolutionize the industry with unparalleled bandwidth and
memory capacity.
DDR5 MRDIMMs offer an innovative, efficient new module design to
enhance data transfer rates and overall system performance.
Multiplexing allows multiple data signals to be combined and
transmitted over a single channel, effectively increasing the
bandwidth without the need for additional physical connections and
providing a seamless bandwidth upgrade to enable applications to
exceed DDR5 RDIMM data rates. Other planned features include:
- Platform compatibility with RDIMM for flexible end-user
bandwidth configuration
- Utilization of standard DDR5 DIMM components including DRAM,
DIMM Form Factor & Pinout, SPD, PMIC, and TS for ease of
adoption
- Efficient I/O scaling using RCD/DB logic process
capability
- Leverage existing LRDIMM ecosystem for design and test
infrastructure
- Support for Multi-generational scaling to DDR5-EOL
The JEDEC MRDIMM standard is set to deliver up to twice the peak
bandwidth of native DRAM, enabling applications to surpass current
data rates and achieve new levels of performance. It maintains the
same capacity, reliability, availability, serviceability (RAS)
features as JEDEC RDIMM. The committee aims to double the bandwidth
to 12.8 Gbps and increase the pin speed. MRDIMM is envisioned to
support more than two ranks and is being designed to utilize
standard DDR5 DIMM components ensuring compatibility with
conventional RDIMM systems.
Plans are underway for a Tall MRDIMM form factor to offer higher
bandwidth and capacity without changes to the DRAM package. This
innovative, taller form factor will enable twice the number of DRAM
single-die packages to be mounted on the DIMM without the need for
3DS packaging.
As a follow-on to JEDEC’s JESD318 CAMM2 Memory Module standard,
JC-45 is developing a next-generation CAMM module for LPDDR6
targeting a maximum speed greater than 14.4 GT/s. As planned, the
module will also offer a 24-bit subchannel, a 48-bit channel and a
connector array.
Both projects are in development in JEDEC’s JC-45 Committee for
DRAM Modules. JEDEC encourages companies to join and help shape the
future of JEDEC standards. Membership grants access to
pre-publication proposals and provides early insights into active
projects such as MRDIMM. Discover the benefits of membership and
join today.
JEDEC standards are subject to change during and after the
development process, including disapproval by the JEDEC Board of
Directors.
About JEDEC
JEDEC is the global leader in the development of standards for
the microelectronics industry. Thousands of volunteers representing
over 350 member companies work together in more than 100 JEDEC
committees and task groups to meet the needs of every segment of
the industry, for manufacturers and consumers alike. The
publications and standards generated by JEDEC committees are
accepted throughout the world. All JEDEC standards are available
for download from the JEDEC website. For more information, visit
https://www.jedec.org.
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version on businesswire.com: https://www.businesswire.com/news/home/20240722188979/en/
Emily Desjardins 703-907-7560 emilyd@jedec.org