MOUNTAIN VIEW, Calif.,
Sept. 12, 2011 /PRNewswire/ -- CEVA,
Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon
intellectual property (SIP) platform solutions and DSP cores, today
announced that it is the first company in the semiconductor
industry to offer a Dolby approved DSP core implementation of
Dolby® Mobile. Based on the high-performance CEVA-TeakLite-III DSP,
CEVA's implementation of the third generation Dolby Mobile
technology, including support of Dolby Digital Plus for mobile,
enables a significant time-to-market advantage and power
consumption savings for customers designing mobile audio processors
incorporating Dolby's latest mobile audio enhancements.
(Logo: http://photos.prnewswire.com/prnh/20051010/CEVALOGO
)
Dolby Mobile is designed to give consumers a rich, full-impact
audio experience on portable devices. Designed for easy, flexible
implementation, Dolby Mobile allows device makers to enable a
multitude of stunning audio settings, including full 5.1-channel HD
audio, mobile surround and natural bass. Many of these impressive
features require DSP-intensive, audio post-processing techniques to
be performed in real-time on the mobile device, and call for a
high-performance DSP-based audio processor architecture for
efficient implementation. The CEVA-TeakLite-III DSP based
implementation consumes up to 5X less power than today's CPU-based
alternatives, delivering critical power savings and extending
battery life for Dolby Mobile-enabled devices, such as smartphones
and tablets.
"The availability of our Dolby Mobile technology on the
CEVA-TeakLite-III DSP constitutes a compelling solution for
customers designing advanced mobile audio processors," said
Patrick Flanagan, Director of
Product Marketing, Mobile Ecosystem, Dolby Laboratories. "CEVA's
low power DSP architecture enables Dolby Mobile to efficiently
deliver the advanced audio that consumers demand, without
sacrificing battery-life of the target device."
"CEVA is proud to be the first company to offer the latest
generation Dolby Mobile for a DSP core, providing our customers
with a significant time-to-market advantage for mobile audio SoC
designs," said Eran Briman, vice
president of marketing at CEVA. "Furthermore, with the
CEVA-TeakLite-III, we have demonstrated clear performance and power
consumption advantages when implementing advanced mobile audio
processing, addressing one of the most critical issues in mobile
SoC design today."
The provision of the third generation of the Dolby Mobile was
achieved using actual CEVA-TeakLite-III silicon, providing CEVA
customers with a silicon-proven hardware and software solution that
streamlines the overall design cycle for advanced mobile audio
processors.
CEVA-TeakLite-III is a native 32-bit, high performance DSP core,
used in mobile baseband and application processor chips, to handle,
among other tasks, advanced mobile audio scenarios, such as
multi-stream audio playback with various post-processing functions
for enhanced audio experience. The DSP solution includes a
configurable cached memory subsystem, a comprehensive set of
optimized HD audio codecs, and complete software development kit,
including software development tools, prototype boards, test chips,
system drivers and RTOS.
To learn more about CEVA-TeakLite-III, visit
www.ceva-dsp.com/products/cores/ceva-teaklite-III.php
Availability
CEVA-TeakLite-III is available for licensing today, with more
than 90 voice and audio codecs and post-processing functions,
including Dolby Mobile. For more information, contact
sales@ceva-dsp.com.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual
property (SIP) DSP cores and platform solutions for the mobile
handset, portable and consumer electronics markets. CEVA's IP
portfolio includes comprehensive technologies for cellular baseband
(2G / 3G / 4G), multimedia, HD video and audio, voice over packet
(VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA).
In 2010, CEVA's IP was shipped in over 600 million devices,
powering handsets from 7 out of the top 8 handset OEMs, including
Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more
than one in every three handsets shipped worldwide is powered by a
CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow
CEVA on twitter at www.twitter.com/cevadsp.
SOURCE CEVA, Inc.