HIW Hiwave Tech

TIDMHIW

Hiwave Technologies PLC

22 May 2012

HiWave Technologies plc ("HiWave")

HiWave Strengthens its Intellectual Property Portfolio

Cambridge, UK, May 22, 2012:HiWave Technologies (LSE:HIW) has further strengthened its position in the human interface technology sector through a series of new patents filings.

Following successful renegotiation of key haptic patents previously assigned to Nissha Printing in Japan, HiWave has filed eight further patents ensuring that the company is protecting its long-term ability to innovate in the haptic and touch arena, and that barriers to competitive entry remain very high.

Under the protection afforded by patents, and having removed exclusive license agreements - obligations that were a constraint to HiWave's own access to this market - HiWave is now engaging directly and on a regular basis with the leading consumer electronics companies. This provides us with the feedback necessary for us to define and implement our technology roadmap and develop intellectual property which is designed to solve some of the technological challenges that existing and potential customers are faced with.

James Lewis, CEO commented:

"Recent breakthroughs by our development team in the field of haptic, touch and audio human interface have put HiWave on the radar screen of major consumer electronics companies. Our recent patent filings permit us to lock in intellectual capital for commercial exploitation as we move forward".

New patents filed cover new transducer developments as well as techniques and processes to create haptic sensations that enhance user experience in touch panels. This includes input devices as well as display panels such as those used in hand-held products. All HiWave's new patent filings are contributing to new product developments, and in certain cases, already being realised in the company's latest haptic demonstrators which combine its haptic controller semiconductor developments and small form-factor transducers.

Additionally two patents have been filed to protect recent transducer and audio processing developments for personal audio applications. HiWave is applying its bending wave audio technology to solutions that address the growing requirement for an immersive audio experience that does not prevent the user from hearing the surrounding environment - earphones that do not block the ear.

HiWave also announces that it has recently been granted several previously filed patents relating to audio transducers, BMR speaker drive units and audio amplifier technology, ensuring that is able to protect its innovative technology as its sales team opens up commercial opportunities worldwide.

Ends

For further information please contact:

 
 HiWave Technologies plc        +44 (0)1223 598 490 
 James Lewis 
  http://www.hiwave.com 
 
 Media enquiries 
 Publitek Limited 
  Bob Jones or Rob Ashwell 
  Email: hiwave@publitek.com    +44 (0)1225 470000 
 
 FTI Consulting                 +44 (0)20 7831 3113 
 Sophie McMillan 
  Clare Thomas 
 

About HiWave:

HiWave Technologies develops and sells electronic components and devices with innovative sound and touch technologies to add outstanding user appeal to consumer electronics.

HiWave's audio amplifier chips and modules are as much as 20 times more efficient than other sound technologies and its loudspeaker drivers create extremely high quality sound using bending wave technology.

HiWave's patented haptic 'touch' technologies transform a flat screen on a smartphone or tablet computer so that the user can feel the switch or click of a keypad but without any moving parts.

This information is provided by RNS

The company news service from the London Stock Exchange

END

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