Samsung Electronics Begins Mass Production of Industry’s Thinnest LPDDR5X DRAM Packages for On-Device AI
06 Agosto 2024 - 5:39AM
Business Wire
Samsung’s compact LPDDR5X DRAM packages
measure 0.65mm high, allowing enhanced thermal control suitable for
on-device AI mobile applications
The LPDDR package stacks four layers of
12nm-class DRAM die, reducing thickness and improving heat
resistance while increasing density
Samsung Electronics Co., Ltd., the world leader in advanced
memory technology, today announced it has begun mass production for
the industry’s thinnest 12 nanometer (nm)-class, 12-gigabyte (GB)
and 16GB LPDDR5X DRAM packages, solidifying its leadership in the
low-power DRAM market.
This press release features multimedia. View
the full release here:
https://www.businesswire.com/news/home/20240806495293/en/
Samsung’s compact LPDDR5X DRAM packages
measure 0.65mm high, allowing enhanced thermal control suitable for
on-device AI mobile applications (Photo: Business Wire)
Leveraging its extensive expertise in chip packaging, Samsung is
able to deliver ultra-slim LPDDR5X DRAM packages that can create
additional space within mobile devices, facilitating better
airflow. This supports easier thermal control, a factor that is
becoming increasingly critical especially for high-performance
applications with advanced features such as on-device AI.
"Samsung’s LPDDR5X DRAM sets a new standard for high-performance
on-device AI solutions, offering not only superior LPDDR
performance but also advanced thermal management in an
ultra-compact package," said YongCheol Bae, Executive Vice
President of Memory Product Planning at Samsung Electronics. "We
are committed to continuous innovation through close collaboration
with our customers, delivering solutions that meet the future needs
of the low-power DRAM market."
With the new LPDDR5X DRAM packages, Samsung offers the
industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure1,
reducing the thickness by approximately 9% and improving heat
resistance by about 21.2%, compared to the previous generation
product.
By optimizing printed circuit board (PCB) and epoxy molding
compound (EMC)2 techniques, the new LPDDR DRAM package is as thin
as a fingernail at 0.65 millimeters (mm), the thinnest among
existing LPDDR DRAM of 12GB or above. Samsung’s optimized
back-lapping3 process is also used to minimize the package
height.
Samsung plans to continue expanding the low-power DRAM market by
supplying its 0.65mm LPDDR5X DRAM to mobile processor makers as
well as mobile device manufacturers. As demand for
high-performance, high-density mobile memory solutions in smaller
package sizes continues to grow, the company plans to develop
6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM
packages for future devices.
About Samsung Electronics Co.,
Ltd.
Samsung inspires the world and shapes the future with
transformative ideas and technologies. The company is redefining
the worlds of TVs, smartphones, wearable devices, tablets, home
appliances, network systems, and memory, system LSI, foundry and
LED solutions, and delivering a seamless connected experience
through its SmartThings ecosystem and open collaboration with
partners. For the latest news, please visit the Samsung Newsroom at
news.samsung.com
1 Structure with four layers packaged together, and each layer
consists of two LPDDR DRAMs. 2 Material that protects
semiconductor circuits from various external environments such as
heat, impacts, and moisture. 3 Grinding the backside of a
wafer.
View source
version on businesswire.com: https://www.businesswire.com/news/home/20240806495293/en/
Ujeong Jahnke Samsung Semiconductor Europe GmbH Tel.
+49(0)89-45578-1000 Email: sseg.comm@samsung.com