Report of Foreign Issuer (6-k)
30 Abril 2018 - 8:36AM
Edgar (US Regulatory)
1934 Act Registration
No. 1-30702
SECURITIES AND EXCHANGE COMMISSION
Washington, DC 20549
FORM
6-K
REPORT OF
FOREIGN PRIVATE ISSUER
PURSUANT TO RULE
13a-16
OR
15d-16
OF
THE SECURITIES EXCHANGE ACT OF 1934
For the month of April, 2018
Siliconware
Precision Industries Co., Ltd.
(Translation of Registrants Name Into English)
NO. 123, SEC. 3, DA FONG RD. TANTZU
TAICHUNG, TAIWAN
(Address
of Principal Executive Offices)
(Indicate by check mark whether the registrant files or will file annual reports under cover of Form
20-F
or Form
40-F)
Form
20-F ☒ Form
40-F ☐
(Indicate by check mark if the registrant is submitting the Form
6-K
in paper as permitted by Regulation
S-T
Rule 101(b)(1): ☐)
(Indicate by check mark if the registrant is submitting the Form
6-K
in paper as permitted by Regulation
S-T
Rule 101(b)(7): ☐)
News Release
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Contact:
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Siliconware Precision Industries Co., Ltd.
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Eva Chen, VP of Finance Div.
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No. 123, Sec. 3, Da Fong Rd., Tantzu,
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SPILIR@spil.com.tw
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Taichung, Taiwan 42749
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+886-4-25341525#1536
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www.spil.com.tw
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Byron Chiang, Spokesperson
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Spokesperson@spil.com.tw
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+886-3-5795678#3676
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SPIL Announces Completion of Share Exchange
Issued by: Siliconware Precision Industries Co., Ltd.
Issued
on: April 30, 2018
April 30, 2018 Siliconware Precision Industries Co., Ltd. (SPIL or the Company) (Taiwan Stock
Exchange: 2325, NASDAQ: SPIL) announces that the transactions contemplated under a Joint Share Exchange Agreement (the Joint Share Exchange Agreement), dated as of June 30, 2016 between the Company and Advanced Semiconductor
Engineering, Inc. (ASE), are now completed.
About SPIL
Siliconware Precision Industries Ltd. (SPIL) (Taiwan Stock Exchange: 2325 NASDAQ: SPIL) is a leading provider of comprehensive semiconductor
assembly and test services. SPIL is dedicated to meeting all of its customers integrated circuit packaging and testing requirements, with turnkey solutions that range from design consultations, modeling and simulations, wafer bumping, wafer
probe and sort, package assembly, final test,
burn-in,
to shipment. Products include advanced leadframe, substrate packages, wafer bumping and FCBGA, which are widely used in personal computers,
communications, Internet appliances, cellular phones, digital cameras, cable modems, personal digital assistants and LCD monitors. SPIL supplies services and support to fabless design houses, integrated device manufacturers and wafer foundries
globally. For further information, visit SPILs web site at www.spil.com.tw.
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by
the undersigned, thereunto duly authorized.
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Siliconware Precision Industries Co., Ltd
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Date: April 30, 2018
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By:
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/s/ Ms. Eva Chen
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Eva Chen
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Chief Financial Officer
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Siliconware Precision Industries (NASDAQ:SPIL)
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