- Combined chipset delivers unprecedented power and performance
for 400G and 800G transceivers
Today, DustPhotonics, a leading developer of silicon photonics
technology and solutions, and MaxLinear, a leading semiconductor
company for communication applications, announced that they have
partnered to demonstrate a silicon photonics chipset with
integrated lasers directly driven from a DSP without the use of any
external driver chip, providing exceptional total system
performance.
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New MaxLinear and DustPhotonics silicon
photonics integrated solution delivers unprecedented power and
performance for 400G and 800G optical transceivers (Graphic:
Business Wire)
The MaxLinear Keystone DSP (Digital Signal Processor) and
DustPhotonics Carmel Silicon Photonics chip were shown together to
support direct-drive operation, which reduces the overall cost and
power dissipation of optical transceivers for data communication.
This combined solution is ideal for applications such as 400Gb/s
and 800Gb/s pluggable modules and on-board optics.
The DustPhotonics chip includes an integrated DFB
(Distributed-feedback) laser and DustPhotonics revolutionary Low
Loss Laser Coupling technology (L3C), achieving a very efficient
coupling of light into the Photonic Integrated Circuit (PIC). This
unique technology enables the use of 1 laser for every 4
channels.
The MaxLinear Keystone chip is part of a family of DSPs capable
of both 400Gb/s and 800Gb/s operation, based on TSMC’s 5nm process.
The Keystone DSP provides a rich set of features for transceivers,
CPO (Co-Packaged Optics) modules and on-board optics while
achieving significantly lower power than competitive solutions. The
integrated drivers are optimized for silicon photonics direct-drive
and provide the best industry performance for this application.
The combined solution enables performance that significantly
exceeds all IEEE specifications. In terms of power consumption,
400Gb/s transceivers can now be designed to reach sub 7W.
“DustPhotonics is focused on enabling best-in-class Silicon
Photonics chips to simplify the efforts of transceiver and systems
designers,” said Yoel Chetrit, Vice President R&D of
DustPhotonics. “Not only can our Carmel chip simplify the overall
system design by reducing the total number of lasers to a single
laser for 4 channels, but it also eliminates the external driver,
which reduces the cost, power and complexity of the overall
system.”
“The combination of our Keystone 5nm integrated driver DSPs with
DustPhotonics’ silicon photonics demonstrates the significant power
and performance advantages achievable with our integrated drivers,”
said Drew Guckenberger, Vice President of Optical Interconnect at
MaxLinear. “With double-digit year-on-year growth in market demand
for 400Gb/s and 800Gb/s transceivers, this integrated solution can
create tremendous value for our customers. We look forward to
seeing full transceiver deployments in the near future.”
About DustPhotonics
DustPhotonics develops silicon photonics chips (PICs) and
technology for optical communications. Our PIC product powers
400Gb/s and 800Gb/s transceiver solutions, and our unique Low Loss
Laser Coupling (L3C) Technology offers improvements in performance,
power consumption and cost. All products and technologies utilize
standard components, processes and manufacturing to enable the
quality and scale required for highvolume manufacturing. Please
visit www.dustphotonics.com for more information.
About MaxLinear
MaxLinear, Inc. (NASDAQ: MXL) is a leading provider of radio
frequency (RF), analog, digital and mixed-signal integrated
circuits for access and connectivity, wired and wireless
infrastructure, and industrial and multimarket applications.
MaxLinear is headquartered in Carlsbad, California. For more
information, please visit www.maxlinear.com.
MxL and the MaxLinear logo are trademarks of MaxLinear, Inc.
Other trademarks appearing herein are the property of their
respective owners.
Cautionary Note About Forward-Looking Statements
This press release contains “forward-looking” statements within
the meaning of federal securities laws. Forward-looking statements
include, among others, statements concerning or implying future
financial performance, anticipated product performance and
functionality of our products or products incorporating our
products, and industry trends and growth opportunities affecting
MaxLinear, in particular statements relating to MaxLinear’s
partnership with DustPhotonics and MaxLinear’s Keystone Digital
Signal Processor products, including but not limited to, with
respect to partnership with anticipated growth in the potential
market opportunities, functionality, performance, integration, and
the benefits of use of such products. These forward-looking
statements involve known and unknown risks, uncertainties, and
other factors that may cause actual results to differ materially
from any future results expressed or implied by these
forward-looking statements. We cannot predict whether or to what
extent these new and existing products will affect our future
revenues or financial performance. Forward-looking statements are
based on management’s current, preliminary expectations and are
subject to various risks and uncertainties that could cause actual
results to differ materially from those described in the
forward-looking statements. Forward-looking statements may contain
words such as “will be,” “will,” “expected,” “anticipate,”
“continue,” or similar expressions and include the assumptions that
underlie such statements. The following factors, among others,
could cause actual results to differ materially from those
described in the forward-looking statements: intense competition in
our industry and product markets; risks relating to the
development, testing, and commercial introduction of new products
and product functionalities; the ability of our customers to cancel
or reduce orders; uncertainties concerning how end user markets for
our products will develop; our lack of long-term supply contracts
and dependence on limited sources of supply; potential decreases in
average selling prices for our products; impacts from public health
crises, such as the Covid-19 pandemic, geopolitical conflicts, such
as the military conflict in Ukraine and related sanctions against
Russia and Belarus, or natural disasters; and the potential for
intellectual property litigation, which is prevalent in our
industry. In addition to these risks and uncertainties, investors
should review the risks and uncertainties contained in MaxLinear’s
filings with the United States Securities and Exchange Commission,
including risks and uncertainties arising from other factors
affecting the business, operating results, and financial condition
of MaxLinear, including those set forth in MaxLinear’s most recent
Annual Report on Form 10-K, Quarterly Reports on Form 10-Q, and
Current Reports on Form 8-K, as applicable. All forward-looking
statements are qualified in their entirety by this cautionary
statement. MaxLinear is providing this information as of the date
of this release and does not undertake any obligation to update any
forward-looking statements contained in this release as a result of
new information, future events, or otherwise.
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MaxLinear Inc. Press Contact: Debbie Brandenburg Sr.
Marketing Communications Manager Tel: +1 669-265-6083
dbrandenburg@maxlinear.com
MaxLinear Inc. Corporate Contact: Drew Guckenberger, Vice
President of Optical Interconnect Tel: +1 760-692-0711
press@maxlinear.com
DustPhotonics Press Contact: Daniela Morein Bar Marketing
Director Tel: +972 50 322-0777 daniela@inspiredmarketing.co.il
DustPhotonics Corporate Contact: Ronnen Lovinger Tel +972
54 546-8808 Ronnen.lovinger@dustphotonics.com
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