Aehr Test Systems to Participate in the Jefferies Semiconductor, IT Hardware & Communications Technology Summit on August 29, 2023
23 Agosto 2023 - 6:30AM
Aehr Test Systems (
NASDAQ: AEHR),
a worldwide supplier of semiconductor test and
burn-in equipment, today announced that it will participate in
the Jefferies Semiconductor, IT Hardware & Communications
Technology Summit taking place August 29-30, 2023 at the Four
Seasons Hotel in Chicago. President and CEO Gayn Erickson and
CFO Chris Siu will be hosting meetings with investors throughout
the day on Tuesday, August 29.
“We look forward to discussing our unique semiconductor
production test and burn-in solutions and the markets
they serve with investors and shareholders at the Jefferies
conference,” said Gayn Erickson, President and CEO of Aehr
Test Systems. “Aehr Test provides complete production solutions for
improving quality, reliability, and yield of semiconductors such as
silicon carbide devices used in electric vehicles and charging
infrastructure, silicon photonics devices used in data centers
and 5G infrastructure, and also for new applications such as
optical input/output (I/O) and co-packaged optics devices that are
on the horizon. The adoption of wafer level test and burn-in of
devices where quality, reliability, safety, and security are
critical to the customers is a significant growth driver for Aehr
Test.”
For additional information or to schedule a meeting with Aehr
management, please contact your Jefferies representative or Aehr’s
investor relations firm, MKR Investor Relations, at
aehr@mkr-group.com.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a leading provider of
test solutions for testing, burning-in, and stabilizing
semiconductor devices in wafer level, singulated die, and package
part form, and has installed thousands of systems worldwide.
Increasing quality, reliability, safety, and security needs of
semiconductors used across multiple applications, including
electric vehicles, electric vehicle charging infrastructure, solar
and wind power, computing, data and telecommunications
infrastructure, and solid-state memory and storage, are driving
additional test requirements, incremental capacity needs, and new
opportunities for Aehr Test products and solutions. Aehr has
developed and introduced several innovative products including the
FOX-PTM families of test and burn-in systems and FOX WaferPakTM
Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The FOX-XP and FOX-NP systems are full wafer contact and
singulated die/module test and burn-in systems that can test,
burn-in, and stabilize a wide range of devices such as leading-edge
silicon carbide-based and other power semiconductors, 2D and 3D
sensors used in mobile phones, tablets, and other computing
devices, memory semiconductors, processors, microcontrollers,
systems-on-a-chip, and photonics and integrated optical devices.
The FOX-CP system is a low-cost single-wafer compact test solution
for logic, memory and photonic devices and the newest addition to
the FOX-P product family. The FOX WaferPak Contactor contains a
unique full wafer contactor capable of testing wafers up to 300mm
that enables IC manufacturers to perform test, burn-in, and
stabilization of full wafers on the FOX-P systems. The FOX DiePak
Carrier allows testing, burning in, and stabilization of singulated
bare die and modules up to 1024 devices in parallel per DiePak on
the FOX-NP and FOX-XP systems up to nine DiePaks at a time. For
more information, please visit Aehr Test Systems’ website at
www.aehr.com.
Contacts:Aehr Test
Systems Chris
Siu
Chief Financial Officercsiu@aehr.com
MKR Investor Relations Inc.Todd Kehrli or Jim
ByersAnalyst/Investor Contact (323)
468-2300
aehr@mkr-group.com
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