HSINCHU, Jan. 10,
2024 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES
INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and
NASDAQ: IMOS), an industry leading provider of outsourced
semiconductor assembly and test services ("OSAT"), today reported
its unaudited consolidated revenue for the month of December 2023 and for the fourth quarter ended
December 31, 2023. All U.S. dollar
figures cited in this press release are based on the exchange rate
of NT$30.62 to US$1.00 as of December 29,
2023.
Revenue for the fourth quarter of 2023 increased 22.2% from the
fourth quarter of 2022 to NT$5,725.4
million or US$187.0 million,
representing an increase of 2.6% from the third quarter of 2023.
The Company noted revenue growth in the fourth quarter of 2023,
both year over year and quarter over quarter, was led by
improvements across the broader memory industry.
Revenue for the month of December
2023 was NT$1,881.5 million or
US$61.4 million, representing an
increase of 0.4% from November 2023,
and an increase of 21.1% from December
2022.
|
Consolidated Monthly
Revenues (Unaudited)
|
|
December
2023
|
November
2023
|
December
2022
|
MoM Change
|
YoY Change
|
|
Revenues
(NT$
million)
|
1,881.5
|
1,873.9
|
1,553.8
|
0.4 %
|
21.1 %
|
|
Revenues
(US$
million)
|
61.4
|
61.2
|
50.7
|
0.4 %
|
21.1 %
|
|
Consolidated
Quarterly Revenues (Unaudited)
|
|
Fourth
Quarter
2023
|
Third
Quarter
2023
|
Fourth
Quarter
2022
|
QoQ Change
|
YoY Change
|
|
Revenues
(NT$
million)
|
5,725.4
|
5,581.5
|
4,686.2
|
2.6 %
|
22.2 %
|
|
Revenues
(US$
million)
|
187.0
|
182.3
|
153.0
|
2.6 %
|
22.2 %
|
About ChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES
INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and
NASDAQ: IMOS) (www.chipmos.com) is an industry leading provider of
outsourced semiconductor assembly and test services. With advanced
facilities in Hsinchu Science Park, Hsinchu Industrial Park and
Southern Taiwan Science Park in Taiwan, ChipMOS is known for its track record
of excellence and history of innovation. The Company provides
end-to-end assembly and test services to leading fabless
semiconductor companies, integrated device manufacturers and
independent semiconductor foundries serving virtually all end
markets worldwide.
Forward-Looking Statements:
This press release may
contain certain forward-looking statements. These forward-looking
statements may be identified by words such as 'believes,'
'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,'
'estimates,' 'future' or similar expressions or by discussion of,
among other things, strategies, goals, plans or intentions. These
statements may include financial projections and estimates and
their underlying assumptions, statements regarding plans,
objectives and expectations with respect to future operations,
products and services, and statements regarding future performance.
Actual results may differ materially in the future from those
reflected in forward-looking statements contained in this document,
due to various factors. Further information regarding these risks,
uncertainties and other factors are included in the Company's most
recent Annual Report on Form 20-F filed with the U.S. Securities
and Exchange Commission (the "SEC") and in the Company's other
filings with the SEC.
Contacts:
|
In Taiwan
Jesse Huang
ChipMOS TECHNOLOGIES
INC.
+886-6-5052388 ext.
7715
IR@chipmos.com
|
In the U.S.
David
Pasquale
Global IR
Partners
+1-914-337-8801
dpasquale@globalirpartners.com
|
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SOURCE ChipMOS TECHNOLOGIES INC.
