Customers and collaborators will have early
access to next-generation glass substrate tools and software
solutions to accelerate panel-level packaging R&D
Onto Innovation Inc. (NYSE: ONTO) today announced the opening of
the company’s Packaging Applications Center of Excellence (PACE), a
first-of-its-kind facility in the U.S. dedicated to panel-level
packaging (PLP) innovations enabling 2.5D and 3D chiplet
architectures and AI packages. Collaborating partners represent key
process steps across the supply chain, ranging from panel package
and IC substrate manufacturers to process equipment and material
suppliers. Collaborators include: ASMPT, Corning, Evatec, Lam
Research, LPKF Laser & Electronics SE, MKS Instruments, Resonac
Corporation, Taiyo Ink Mfg. Co., Ltd., and multiple others.
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Onto Innovation’s Packaging Applications
Center of Excellence (PACE) will accelerate panel-level packaging
R&D — enabling the most advanced heterogeneous integration for
artificial intelligence (AI) applications, bringing industry
leaders in substrate manufacturing, process equipment, and
materials together, working toward a common goal. (Photo: Business
Wire)
At PACE, Onto and its collaborators will use their expert
knowledge of lithography, plating, thin film deposition, laser
processes for through glass via (TGV) formation, and new material
developments in photoresist, dielectric and plating chemistry to
work toward sub-1.5µm line/space panel interconnects. In addition,
PACE participants will explore novel organic damascene process
innovations for maintaining proper interconnect line widths, a
critical requirement as the line/space feature size shrinks, in an
effort to replace the conventional semi-additive process for
advanced IC substrates.
To ensure yields for these increasingly fine interconnects, the
PACE collaboration team will also focus on process control
technologies like Onto’s Firefly® G3 system. With glass core
substrates being the next technology inflection, the Firefly G3
system is designed to address new inspection and metrology
challenges associated with transparent panels, such as detecting
missing TGVs and performing TGV critical dimension measurements
across the entire panel.
“With the need for finer, denser interconnects and larger
package sizes to support new AI and chiplet architectures,
customers and collaborators need to accelerate their technology
roadmaps and shorten the time to market,” says Mike Plisinski,
chief executive officer of Onto Innovation. “Together, we will
develop new panel-level packaging solutions in support of glass
core substrates and the rapidly evolving AI landscape.”
Located at Onto’s Wilmington, Massachusetts, headquarters, PACE
offers collaborators and customers access to Onto’s JetStep® X500
glass panel handling lithography system, next generation lens
technology for glass substrates capable of sub-1.5µm line/space
imaging with shot sizes of 141mm x 141mm, and the Discover® Command
Center featuring robust data analytics, process controls and
AI-enabled services integrating Onto tools and third party
solutions. In addition, PACE offers secure data access, an
essential need for preserving the confidentiality of partners’
datasets.
“Onto’s data platform enables partners and customers to only see
data relevant to them while offering a complete view of process
insights via dashboards and interactive applications,” says
Danielle Baptiste, vice president and general manager of Onto’s
enterprise software business.
“For Onto Innovation, PACE provides the Company the opportunity
to unite the leading innovators across IC substrate and panel-level
packaging manufacturing, process equipment and materials in order
to solve complex challenges posed by the adoption of stable glass
substrates for the next generation of compute architectures,”
concludes Mr. Plisinski. “Working collaboratively with our partners
and potential customers, we intend to accelerate these roadmaps and
the benefits higher performance and lower power consumption devices
will have on society.”
If your company is interested in becoming a collaborating
partner or attending the grand opening event on September 30, 2024
at Onto’s headquarters, please contact us or reach out to your
local sales team.
About Onto Innovation Inc.
Onto Innovation is a leader in process control, combining global
scale with an expanded portfolio of leading-edge technologies that
include: Un-patterned wafer quality; 3D metrology spanning chip
features from nanometer scale transistors to large die
interconnects; macro defect inspection of wafers and packages;
metal interconnect composition; factory analytics; and lithography
for advanced semiconductor packaging. Our breadth of offerings
across the entire semiconductor value chain combined with our
connected thinking approach results in a unique perspective to help
solve our customers’ most difficult yield, device performance,
quality, and reliability issues. Onto Innovation strives to
optimize customers’ critical path of progress by making them
smarter, faster and more efficient. With headquarters and
manufacturing in the U.S., Onto Innovation supports customers with
a worldwide sales and service organization. Additional information
can be found at www.ontoinnovation.com.
Forward Looking Statements
This press release contains forward-looking statements within
the meaning of the Private Securities Litigation Reform Act of 1995
(the “Act”) which include statements relating to Onto Innovation’s
business momentum and future growth; the benefit to customers and
collaborators and the capabilities of Onto Innovation’s PACE,
products and service; Onto Innovation’s ability to both deliver
products and services consistent with our customers’ demands and
expectations and strengthen its market position, Onto Innovation’s
beliefs about market opportunities as well as other matters that
are not purely historical data. Onto Innovation wishes to take
advantage of the “safe harbor” provided for by the Act and cautions
that actual results may differ materially from those projected as a
result of various factors, including risks and uncertainties, many
of which are beyond Onto Innovation’s control. Such factors
include, but are not limited to, the Company’s ability to leverage
its resources to improve its position in its core markets; its
ability to weather difficult economic environments; its ability to
open new market opportunities and target high-margin markets; the
strength/weakness of the back-end and/or front-end semiconductor
market segments; fluctuations in customer capital spending; the
Company’s ability to effectively manage its supply chain and
adequately source components from suppliers to meet customer
demand; the effects of political, economic, legal, and regulatory
changes or conflicts on the Company's global operations; its
ability to adequately protect its intellectual property rights and
maintain data security; the effects of natural disasters or public
health emergencies, such as the COVID-19 pandemic, on the global
economy and on the Company’s customers, suppliers, employees, and
business; its ability to effectively maneuver global trade issues
and changes in trade and export license policies; the Company’s
ability to maintain relationships with its customers and manage
appropriate levels of inventory to meet customer demands; and the
Company’s ability to successfully integrate acquired businesses and
technologies. Additional information and considerations regarding
the risks faced by Onto Innovation are available in Onto
Innovation’s Form 10-K report for the year ended December 30, 2023
and other filings with the Securities and Exchange Commission. As
the forward-looking statements are based on Onto Innovation’s
current expectations, the Company cannot guarantee any related
future results, levels of activity, performance or achievements.
Onto Innovation does not assume any obligation to update the
forward-looking information contained in this press release,
whether as a result of new information, future events or otherwise,
except as required by law.
Source: Onto Innovation Inc. ONTO-IC
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version on businesswire.com: https://www.businesswire.com/news/home/20240904306129/en/
Investor Relations: Sidney Ho, +1 408.376.9163
Sidney.ho@ontoinnovation.com
Onto Innovation (NYSE:ONTO)
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Onto Innovation (NYSE:ONTO)
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