Mitsubishi Electric Begins Supplying Power Semiconductor Chips Made from 12-inch Wafers for Semiconductor Module Assembly
29 Septiembre 2024 - 9:10PM
Business Wire
Stable supply of Si power semiconductor chips
expected to support green transformation
Mitsubishi Electric Corporation (TOKYO: 6503) announced today
that its Power Device Works’ Fukuyama Factory has begun large-scale
supply of power semiconductor chips made from 12-inch silicon (Si)
wafers for the assembly of semiconductor modules, effective
immediately. The advanced Si power-semiconductor modules will
initially be used in consumer products. Going forward, Mitsubishi
Electric expects to contribute to green transformation (GX) by
providing a stable and timely supply of semiconductor chips to meet
the growing demand for energy-saving power-electronics devices in
various applications.
The Fukuyama Factory processes wafers for the production of Si
power-semiconductors. The factory is playing a key role in
Mitsubishi Electric’s medium-term plan to double its wafer
processing capacity for Si power- semiconductors by fiscal 2026
compared to five years earlier. By supplying large quantities of
12-inch Si wafers for power semiconductor chips, the company will
ensure stable production of advanced Si power-semiconductor modules
for energy-saving power-electronics equipment.
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Customer Inquiries Semiconductor & Device Marketing Dept.A
and Dept.B Mitsubishi Electric Corporation
www.MitsubishiElectric.com/semiconductors/
Media Inquiries Takeyoshi Komatsu Public Relations Division
Mitsubishi Electric Corporation Tel: +81-3-3218-2346
prd.gnews@nk.MitsubishiElectric.co.jp
www.MitsubishiElectric.com/news/