NXP Selects TSMC 5nm Process for Next Generation High Performance Automotive Platform
12 Junio 2020 - 12:40AM
NXP Semiconductors N.V. (NASDAQ: NXPI) and TSMC (TWSE: 2330, NYSE:
TSM) today announced a collaboration agreement to adopt TSMC’s
5-nanometer (5nm) technology for NXP’s next generation,
high-performance automotive platform. This collaboration combines
NXP’s automotive design expertise with TSMC’s industry-leading 5nm
technology to further drive the transformation of automobiles into
powerful computing systems for the road.
Building upon multiple successful 16nm designs,
TSMC and NXP are expanding their collaboration to create a
System-on-Chip (SoC) platform in 5nm to deliver the next generation
of automotive processors. Using TSMC’s 5nm process, NXP’s offerings
will address a wide variety of functions and workloads, such as
connected cockpits, high-performance domain controllers, autonomous
driving, advanced networking, hybrid propulsion control and
integrated chassis management.
TSMC’s 5nm technology is currently the world’s
most advanced process in volume production. NXP will adopt N5P, an
enhanced version of TSMC’s 5nm technology, which provides about 20
percent faster speed or about 40 percent power reduction compared
to the preceding 7nm generation, and is supported by the industry’s
most comprehensive design ecosystem.
NXP is a leading global automotive supplier with
a rich history in vehicle control, vehicle safety, vehicle
infotainment and digital clusters. NXP’s developments on 5nm,
initially based on its established S32 architecture, will lead to
new architectures offering scalability and a common software
environment, further simplifying and enabling the significant
increase in software performance required in the future car.
Leveraging the computing power and power efficiency of the 5nm
technology, NXP will meet the high levels of integration, power
management and compute power required for advanced vehicle
architectures as well as their stringent safety and security needs
with its renowned IP.
“Modern vehicle architectures need to harmonize
software infrastructure across domains to leverage investments,
scale deployments and share resources,” said Henri Ardevol,
Executive Vice President and GM, Automotive Processing at NXP. “NXP
aims to deliver the premier automotive processing platform based on
TSMC’s 5nm process, with a consistent architecture across domains
and with differentiation in performance, power, and world-class
safety and security. Car OEMs need a simpler coordination of
advanced functions across control-units, the flexibility to locate
and port applications seamlessly, and the certainty of execution in
a critical safety and security context. NXP is powerfully
positioned to deliver those automotive-specific benefits, now with
leading-edge metrics through the TSMC partnership.”
“TSMC’s latest collaboration with NXP truly
demonstrates how automotive semiconductors have evolved from simple
microcontrollers to sophisticated processors on par with chips used
in the most demanding high-performance computing systems,” said Dr.
Kevin Zhang, Vice President of Business Development at TSMC. “TSMC
has enjoyed a long history of strong partnership with NXP, and we
are excited to take the automotive platform another step forward
into the most advanced technology available in the market and
unleash the power of NXP’s innovative products for intelligent
automotive applications and more.”
NXP and TSMC expect the delivery of first
samples of 5nm devices to NXP’s key customers in 2021.
About NXP Semiconductors
NXP Semiconductors N.V. enables secure connections for a smarter
world, advancing solutions that make lives easier, better, and
safer. As the world leader in secure connectivity solutions for
embedded applications, NXP is driving innovation in the automotive,
industrial & IoT, mobile, and communication infrastructure
markets. Built on more than 60 years of combined experience and
expertise, the company has approximately 29,000 employees in more
than 30 countries and posted revenue of $8.88 billion in 2019. Find
out more at www.nxp.com.
NXP and the NXP logo are trademarks of NXP B.V.
All other products or service names are the property of their
respective owners. All rights reserved. © 2020 NXP B.V.
About TSMCTSMC pioneered the
pure-play foundry business model when it was founded in 1987, and
has been the world’s largest dedicated semiconductor foundry ever
since. The Company supports a thriving ecosystem of global
customers and partners with the industry’s leading process
technologies and portfolio of design enablement solutions to
unleash innovation for the global semiconductor industry. With
global operations spanning Asia, Europe, and North America, TSMC
serves as a committed corporate citizen around the world.
TSMC deployed 272 distinct process technologies,
and manufactured 10,761 products for 499 customers in 2019 by
providing broadest range of advanced, specialty and advanced
packaging technology services. TSMC is the first foundry to provide
5-nanometer production capabilities, the most advanced
semiconductor process technology available in the world. The
Company is headquartered in Hsinchu, Taiwan.
TSMC Spokesperson:Wendell HuangVice President and
CFOTel: +886-3-505-5901 |
TSMC Media Contact:Nina KaoHead of Public
RelationsTel: 886-3-5636688 ext.7125036Mobile:
+886-988-239-163E-Mail: nina_kao@tsmc.com |
NXP Worldwide Media ContactJacey ZunigaTel:
+1-512-895-7398E-Mail: jacey.zuniga@nxp.com |
NXP Europe Media ContactJason DealTel:
+44-771-522-8414E-Mail: jason.deal@nxp.com |
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NXP- Auto
NXP - Corporate
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/05dcbc9d-fb49-460d-b4a6-c28da0105380
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