ASE wins Device Technology of the Year award for VIPack™
02 Mayo 2023 - 10:00AM
Business Wire
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE
Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today
announced that its VIPack™ has received the ‘Device Technology of
the Year Award’ in the 2023 3D InCites Awards program. This
accolade recognizes industry-wide contributions in the development
of heterogeneous integration technologies including 3D packaging,
interposer integration, advanced fan-out wafer-level packaging,
MEMS and sensors, and full system integration.
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Introduced in 2022, VIPack™ is an advanced packaging platform
designed to enable vertically integrated package solutions. VIPack™
represents ASE’s next generation of 3D heterogeneous integration
architecture that extends design rules and achieves ultra-high
density and performance. The platform leverages advanced
redistribution layer (RDL) processes, embedded integration, and
2.5D and 3D technologies to help customers achieve unprecedented
innovation when integrating multiple chips within a single
package.
ASE’s VIPack™ is comprised of six core packaging technology
pillars supported by a comprehensive and integrated co-design
ecosystem. These include ASE’s high density RDL-based Fanout
Package-on Package (FOPoP), Fanout Chip-on-Substrate, (FOCoS),
Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout
System-in-Package (FOSiP) as well as Through Silicon Via
(TSV)-based 2.5D and 3D IC and Co-Packaged Optics processing
capabilities. The VIPack™ platform provides the capabilities
necessary to enable trailblazing highly integrated silicon
packaging solutions required to optimize clock speed, bandwidth,
and power delivery, and to reduce co-design time, product
development, and time to market.
Co-Founder of 3D InCites, Françoise von Trapp, conveyed, “ASE
has been making a splash over the past year with VIPack™ and it
caught the judges’ attention for its core technology pillars
supported by a comprehensive and integrated co-design ecosystem.”
She continued, “VIPack™ is being recognized for its innovative
solutions that support complex applications across high-performance
computing (HPC), artificial intelligence (AI), machine learning
(ML) and network applications, as well as optical interconnects. On
behalf of the 3D InCites community, I’d like to extend sincere
congratulations to ASE.”
“This prestigious award acknowledges the tremendous impact of
the VIPack™ platform as it continues to scale, and also brings home
the outstanding efforts of our global teams that are dedicated to
helping customers achieve product differentiation and competitive
advantage,” said Dr. C.P. Hung, Vice President of R&D, ASE.
“The rising adoption of chiplet-based co-designs is further fueling
demand for multi-chip integration into a single package, and ASE’s
VIPack™ delivers a collaborative platform for exceptional
interconnect solutions where 3D heterogeneous integration has
become critical.”
“We feel honored and absolutely thrilled to receive the Device
Technology of the Year award from 3DInCites, as it is not only
testament to the value of VIPack™, but the exemplary creativity of
our teams to advance system capability and propel our industry
forward,” said Yin Chang, ASE’s Senior Vice President of Sales
& Marketing. He continued, “As we move further into the
chiplets era, ASE’s VIPack™ is evolving, and delivering the
technology advancements that enable us to be innovative, original,
and imaginative.”
The award was presented to Mark Gerber, Sr. Director of
Engineering and Technical Marketing, at the IMAPS Device Packaging
Conference 2023 in Fountain Hills, Arizona.
Available now, ASE’s VIPack™ is a scalable platform that will
expand in alignment with industry roadmaps. For more:
https://ase.aseglobal.com/en/vipack
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor
manufacturing services in assembly and test. Alongside a broad
portfolio of established assembly and test technologies, ASE is
also delivering innovative advanced packaging and system-in-package
solutions to meet growth momentum across a broad range of end
markets, including 5G, AI, Automotive, High-Performance Computing,
and more. To learn about our advances in SiP, Fan-out, MEMS &
Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all
ultimately geared towards applications to improve lifestyle and
efficiency, please visit: aseglobal.com or follow us on LinkedIn
and Twitter: @aseglobal.
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version on businesswire.com: https://www.businesswire.com/news/home/20230502005061/en/
North America & Europe: Patricia MacLeod +1.408.314.9740
patricia.macleod@aseus.com Asia Pacific: Jennifer Yuen +65 97501975
jennifer.yuen@aseus.com
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