Yield Engineering Systems (YES) announced
today that it has delivered multiple EcoCoat Vapor Deposition
systems to a leading Diagnostic Testing customer
FREMONT, Calif., Aug. 13, 2024 /PRNewswire/ -- Yield Engineering
Systems (YES) is a leading manufacturer of process equipment for AI
and HPC semiconductor solutions as well as life sciences and
biomedical applications. YES announced today that it has delivered
multiple EcoCoat Vapor Deposition systems to a leading Diagnostic
Testing customer. These systems will be utilized in the
manufacturing of test platforms for Molecular Diagnostic Testing
and PCR for DNA/RNA amplification. YES products have a long history
of demonstrating superior uniformity and coating durability for
both R&D environments and high volume manufacturing flows.
The EcoCoat system is designed to provide a highly uniform
interface layer for a stable coupling chemistry that is required
for chemical synthesis on wafer or glass substrates. This system
provides superior quality and total cost of ownership (CoO)
particularly for the manufacturing of advanced testing
architectures in the Life Sciences.
"The EcoCoat offers a unique combination of in-situ plasma
surface activation and vapor phase deposition of highly uniform,
covalently bound silane monolayers as the essential interface
between an inorganic substrate and functional organic biomolecules.
YES's proprietary process offers a defect-free chemically efficient
uniform coating, resulting in high throughput and low CoO." said
Ken Sautter, Technical Fellow at
YES.
According to Guy Shechter, SVP at
YES, "Our EcoCoat product line offers a controlled, reproducible
scalable manufacturing process. It is uniquely capable of
performing the task of substrate preparation and surface
modification across a wide variety of applications, especially in
Life Sciences. With dosing as low as 100µl and superior temperature
uniformity, the system produces minimal by-products and no solvent
waste is generated. It was designed to ensure a safe environment
for operators in today's fabs."
About YES
YES is a leading provider of differentiated technologies for
materials and interface engineering needed for a wide range of
applications and markets. YES customers are market leaders,
creating next generation solutions for a variety of markets
including Advanced Packaging for AI and HPC, Memory Systems and
Life Sciences. YES manufactures state-of-the-art, cost-effective,
high volume production equipment for semiconductor Advanced
Packaging solutions for wafers and glass panels. The company's
products include Vacuum Cure, Coat & Anneal Tools, Fluxless
Reflow tools, Thru Glass Via and Cavity Etch and Electroless
Deposition tools for the semiconductor industry. YES is
headquartered in Fremont,
California, with a growing global presence. For more
information, please visit YES.tech.
Media Contact
Alex Chow
SVP Business Development &Mktg / Asia
President
YES (Yield Engineering Systems, Inc.)
+886-926136155 direct
achow@yieldengineering.com
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