Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and burn-in equipment, today
announced it has received an initial customer order for a FOX-NP™
wafer level test and burn-in system, multiple WaferPak™ Contactors,
and a FOX WaferPak Aligner to be used for engineering,
qualification, and small lot production wafer level test and
burn-in of their silicon carbide devices. The customer is a
US-based multibillion-dollar semiconductor supplier serving several
markets including automotive, computing, consumer, energy,
industrial, and medical. The FOX-NP system, including the FOX
WaferPak Aligner and initial WaferPaks are scheduled per the
customer’s requested accelerated schedule to ship by the end of the
calendar year 2023.
The FOX-NP system is configured with the new Bipolar Voltage
Channel Module (BVCM) and Very High Voltage Channel Module (VHVCM)
options that enable new advanced test and burn-in capabilities for
silicon carbide power semiconductors using Aehr’s proprietary
WaferPak full wafer Contactors. This new order highlights Aehr’s
continued progression within the growing silicon carbide global
power market.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “We are very excited that after conducting a detailed
financial evaluation and multiple onsite visits to Aehr’s
application lab, this new customer selected our FOX-P solution for
engineering, qualification, and production of their silicon carbide
power devices. This evaluation included cost of ownership and
system throughput, as well as device test, burn-in, and
stabilization coverage. As their production capacity increases,
they told us that they will quickly move to our FOX-XP multi-wafer
test and burn-in systems for high-volume production. In addition to
the automotive electric vehicle device opportunity, this customer
in particular sees the enormous opportunity for silicon carbide
power devices in industrial, solar, and other power
applications.
“William Blair forecasts that in addition to the 4.5 million
six-inch equivalent wafers that will be needed to meet the demand
for electric vehicle related silicon carbide devices in 2030,
another 2.8 million wafers are needed to
address industrial, solar, electric trains, energy
conversion and other applications in 2030. The
interesting part of this is that most of these applications will be
served with discrete MOSFETs in single die packages. The cost of
ownership of our solution proved to be more cost-effective and
efficient for these devices than package part burn-in after the die
are packaged in packages such as TO-247 or other discrete packages.
This is a strong testimony of the advantage of wafer level burn-in
as a better alternative to package part burn-in. This expands our
silicon carbide test and burn-in market even more and this new
customer helps expand Aehr’s presence in this market as our total
addressable market (TAM) continues to grow.
“Aehr’s FOX-P systems and proprietary WaferPak full wafer
Contactors enable our customers to do economical production volume
test and reliability burn-in with processes such as High
Temperature Gate Bias (HTGB) and High Temperature Reverse Bias
(HTRB) very cost-effectively and ensure extremely high device
quality. Our systems are typically used for long burn-in times
lasting up to 24 hours or more. We can do this for under $5.00 per
hour per wafer capital depreciation cost while testing and
burning-in up to several thousand devices at a time per wafer. This
is also in a test system footprint that is up to 94% less than a
typical test system on a standard semiconductor wafer prober, which
in a precious clean room wafer facility is extremely important and
saves a great deal of cost.
“The FOX family of compatible systems including the FOX-NP and
FOX-XP multi-wafer test and burn-in systems and Aehr’s proprietary
WaferPak full wafer contactors provide a uniquely cost-effective
solution for burning in multiple wafers of devices at a single time
to remove early life failures of silicon carbide devices, which is
critical to meeting the initial quality and long-term reliability
of the automotive, industrial, and electrification infrastructure
industry needs.”
The FOX-XP and FOX-NP systems, available with multiple WaferPak
Contactors (full wafer test) or multiple DiePak™ Carriers
(singulated die/module test) configurations, are capable of
functional test and burn-in/cycling of devices such as silicon
carbide and gallium nitride power semiconductors, silicon photonics
as well as other optical devices, 2D and 3D sensors, flash
memories, magnetic sensors, microcontrollers, and other
leading-edge ICs in either wafer form factor, before they are
assembled into single or multi-die stacked packages, or in
singulated die or module form factor.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a
leading provider of test solutions for testing, burning-in, and
stabilizing semiconductor devices in wafer level, singulated die,
and package part form, and has installed thousands of systems
worldwide. Increasing quality, reliability, safety, and security
needs of semiconductors used across multiple applications,
including electric vehicles, electric vehicle charging
infrastructure, solar and wind power, computing, data and
telecommunications infrastructure, and solid-state memory and
storage, are driving additional test requirements, incremental
capacity needs, and new opportunities for Aehr Test products and
solutions. Aehr has developed and introduced several innovative
products including the FOX-P™ families of test and burn-in
systems and FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX
DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP
systems are full wafer contact and singulated die/module test and
burn-in systems that can test, burn-in, and stabilize a wide range
of devices such as leading-edge silicon carbide-based and other
power semiconductors, 2D and 3D sensors used in mobile phones,
tablets, and other computing devices, memory semiconductors,
processors, microcontrollers, systems-on-a-chip, and photonics and
integrated optical devices. The FOX-CP system is a low-cost
single-wafer compact test solution for logic, memory and photonic
devices and the newest addition to the FOX-P product family. The
FOX WaferPak Contactor contains a unique full wafer contactor
capable of testing wafers up to 300mm that enables IC manufacturers
to perform test, burn-in, and stabilization of full wafers on the
FOX-P systems. The FOX DiePak Carrier allows testing, burning in,
and stabilization of singulated bare die and modules up to 1024
devices in parallel per DiePak on the FOX-NP and FOX-XP systems up
to nine DiePaks at a time. For more information, please visit Aehr
Test Systems’ website at www.aehr.com.
Safe Harbor Statement
This press release contains certain forward-looking statements
within the meaning of Section 27A of the Securities Act of 1933 and
Section 21E of the Securities Exchange Act of 1934. Forward-looking
statements generally relate to future events or Aehr’s future
financial or operating performance. In some cases, you can identify
forward-looking statements because they contain words such as
"may," "will," "should," "expects," "plans," "anticipates,” “going
to,” "could," "intends," "target," "projects," "contemplates,"
"believes," "estimates," "predicts," "potential," or "continue," or
the negative of these words or other similar terms or expressions
that concern Aehr’s expectations, strategy, priorities, plans, or
intentions. Forward-looking statements in this press release
include, but are not limited to, future requirements and orders of
Aehr’s new and existing customers; bookings forecasted for
proprietary WaferPak™ and DiePak consumables; and expectations
related to long-term demand for Aehr’s productions and the
attractiveness of key markets. The forward-looking statements
contained in this press release are also subject to other risks and
uncertainties, including those more fully described in Aehr’s
recent Form 10-K, 10-Q and other reports filed from time to time
with the Securities and Exchange Commission. Aehr disclaims any
obligation to update information contained in any forward-looking
statement to reflect events or circumstances occurring after the
date of this press release.
Contacts: |
|
Aehr Test SystemsVernon RogersEVP of Sales &
Marketing(510) 623-9400 x215vrogers@aehr.com |
MKR Investor Relations Inc.Todd Kehrli or Jim
ByersAnalyst/Investor Contact(323) 468-2300aehr@mkr-group.com |
Aehr Test Systems (NASDAQ:AEHR)
Gráfica de Acción Histórica
De Abr 2024 a May 2024
Aehr Test Systems (NASDAQ:AEHR)
Gráfica de Acción Histórica
De May 2023 a May 2024