Advantest Features Low-Cost High Performance RF and SoC Test Solutions at Semicon West
14 Julio 2008 - 3:00PM
PR Newswire (US)
Introduces Fully Integrated RF Test Cell Solution and demonstrates
new, compact, cost effective, SoC Test Solution for Digital
Consumer and Mixed-Signal ICs SAN FRANCISCO, July 14
/PRNewswire-FirstCall/ -- Advantest Corporation
(TSE:6857TSE:NYSE:TSE:ATE), the world's leading supplier of
semiconductor test equipment, is introducing its new, high-
performance RF test cell solution at Semicon West, and is also
demonstrating its new compact test solution for cost sensitive
consumer devices. In its booth #7447 West, Advantest will also
feature its suite of memory solutions for high-productivity, low
cost-of-ownership engineering and manufacturing applications.
Semicon West is being held from July 15-17 at San Francisco's
Moscone Center. Long the established leader in parallel test
technology, Advantest is now applying its multi-disciplined
expertise in test cell technology to revolutionize test in the SoC
arena. Leveraging from decades of experience and a significant
global installed base of test-cells, Advantest has now upped the
performance standards for SoC test with the industry's only single,
monolithic, highly parallel, turn-key test cell solution for RF and
cost-sensitive consumer SoCs. The only ATE company which designs
and manufactures its own handlers, interfacing, and testers,
Advantest stands alone in offering customers a fully integrated,
high-performance SoC test cell solution that significantly lowers
the cost of test for today's complex consumer ICs. Advantest's
introduction of a turn-key RF test cell solution offers the
industry a new paradigm of test for today's demanding RF devices.
Advantest's turnkey, highly parallel solution is comprised of the
new T2000 LS mainframe and new 12GHz RF module along with its new
M4841 state-of-the-art handler and a unique low noise, highly
parallel DUT interface, yielding a complete test cell optimized for
quad-device RF parallel testing. Customers can benefit from
Advantest's significant experience in testers, handler, and
interface design to speed deployment of challenging RF test
solutions significantly reducing risk and time to volume. This
test-cell solution provides the industry's lowest cost of ownership
for multi-site RF production testing. Also at Semicon West,
Advantest is showcasing its compact T2000 GS mainframe solution
which is designed to lower the cost-of-test of SoC devices used in
digital consumer, RF and mixed-signal products. The compact
solution, which debuted at Semicon Japan in December 2007,
incorporates the newly developed T2000 GS mainframe, together with
new air-cooled 250MDMA digital test module, which includes a
high-performance hardware histogram capability to enable a very
high-speed parallel SOC test solution with a very low cost-
of-test. Industry's first 12GHz monolithic module with quad density
RF signal generators and analyzers Advantest's T2000
open-architecture SoC test system offers unparalleled flexibility
and a wide spectrum of modules to provide customers the lowest cost
of ownership for device testing today and into the future.
Advantest's new RF module is the ATE industry's first fully
integrated 12 GHz monolithic module, boasting 36-port quad-core RF
signal generators and analyzers to speed time to market. With an
ability to test up to 4 RF devices in parallel, this air-cooled,
quad-DUT "out of the box module," affords customers an unmatched
cost of test advantage. Additional modules can be added within a
single test head as needed. Furthermore, with 32 RF pins per
module, each with access to high performance VSG and VSA supporting
40 MHz of complex modulation bandwidth, this module offers the
industry's highest RF pin density for addressing multi-DUT,
multi-band transceivers and Multiple Input Multiple Output (MIMO)
device architectures in both single and multi-site test
configurations. Addressing consumer market demands with
high-parallel, compact test solution Consumer devices such as
microcontrollers, and those used in hand-held gadgets including
cell phones and personal audio products, continue to increase in
functionality while experiencing significant price erosion, To
combat this trend, device manufacturers have been calling for an
efficient, low-cost test solution capable of addressing the
manufacturing requirements of both high-mix, low-volume and general
purpose SoC devices. Advantest's new T2000 Compact Test Solution
responds to this need. Advantest offers a wide range of high-end to
mid-range SoC consumer device test solutions through its T2000 test
system series. The latest mainframe addition to the T2000 test
system family is the new GS mainframe. Its small compact design,
air-cooled test head, and single phase power maximize floor space
and power valued in both development and high-volume production.
Together with the new air-cooled 250MDMA digital test module, this
solution enables low cost high-parallel testing of SoC devices.
This high-density packaging 250MDMA module technology offers 128
channels per module at test speeds of 250Mbps. The GS mainframe
supports up to 32-device parallel testing with even higher site
counts available with other T2000 mainframes. R. Keith Lee,
president and CEO of Advantest America, says, "Our customers in the
RF and consumer SoC segments of the industry are calling for
reliable, accurate high-volume test solutions for devices that are
both complex and dense. They face continual demands to lower test
costs to keep pace with the downward pricing pressures that
characterize the current market environment. Advantest is able to
meet customers' needs by leveraging the strengths of our test cell
technology and product offerings. Advantest stands alone as a
single vendor for turn-key, high-performance test cells. The
company's long history of delivering technically superior,
cost-effective test cell solutions in the memory market, has paved
the way for a transition to the SoC arena, where diverse
engineering and applications resources give Advantest significant
technology to draw upon." Advantest is also participating in the
SEMI TechXPOT technology session addressing Testing Increased
Functional Complexity, on Wednesday, July 16. Anthony Lum, an
Advantest America SoC Product Engineer, will discuss "Breaking the
Barriers to RF Multi-DUT Tests" in his presentation. About
Advantest Advantest Corporation is the world's leading supplier of
automatic test equipment (ATE) to the semiconductor industry.
Advantest's SoC, logic, memory, mixed-signal and RF testers and
device handlers are integrated into the most advanced semiconductor
fabrication lines in the world. Founded in Tokyo in 1954, Advantest
established its North American subsidiary in 1982 and its European
subsidiary in 1984. More information is available at
http://www.advantest.com/. Semicon West Booth No. 7447 DATASOURCE:
Advantest Corporation CONTACT: Amy Gold of Advantest America, Inc.,
+1-212-850-6670, Web site: http://www.advantest.com/
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